Capacitance Pressure Sensor Trace Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Capacitance pressure sensors face challenges in achieving high accuracy and stability due to the complexity of tracing structures for electroconductive members, which affect electrical connections and measurement precision.
Innovation Solution
A capacitance pressure sensor design featuring a substrate with laminated insulation layers, a diaphragm, and strategically placed traces that penetrate and bend between layers to ensure reliable electrical connections, reducing gas leakage and thermal expansion mismatches, utilizing Low Temperature Co-fired Ceramics (LTCC) and silicon carbide materials for enhanced accuracy and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional trace structures are used in capacitance pressure sensors, then electrical connections can be established, but measurement accuracy and stability deteriorate due to gas leakage and thermal expansion mismatches
Solution Approach 1:
The trace structure is segmented into multiple sections with different configurations. First traces connect the first electrode through a via hole with bent portions, while second traces connect the second electrode with different routing patterns. This segmentation allows each trace type to be optimized for its specific function, reducing gas leakage paths and thermal stress concentration points, thereby improving both measurement accuracy and stability
Solution Approach 2:
The trace design transitions from planar routing to three-dimensional routing by penetrating through substrate layers via via holes. The traces bend between different layers (e.g., between the first and second insulating layers), creating a multi-layer trace structure. This dimensional change allows traces to avoid direct linear paths that would create stress concentration points and gas leakage channels, improving measurement reliability
2Ease of manufacture
If straight trace routing is used through substrate layers, then electrical connection is achieved, but thermal stress and gas leakage increase
Solution Approach 1:
The traces incorporate bent portions with curved geometries instead of sharp angles or straight lines. The traces bend smoothly between substrate layers, creating curved paths that distribute mechanical stress more evenly and reduce gas leakage at trace-substrate interfaces. This curvature design maintains manufacturing feasibility while significantly reducing harmful effects
Solution Approach 2:
Via holes serve as intermediary structures that mediate the connection between different substrate layers. The traces pass through these intermediary via holes rather than creating direct through-holes, allowing for stress distribution and reduced gas leakage paths. The via holes act as buffer zones that mitigate the harmful effects of direct trace penetration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable and accurate pressure measurement by minimizing gas leakage and thermal stress, improving the sensor's corrosive resistance and thermal stability, and maintaining precise dimensionality through MEMS fabrication techniques.
Implementation Method 1
a capacitance pressure sensor comprising: a substrate which has insulation layers wherein the insulation layers are laminated; a diaphragm placed to face the substrate so that a space is formed between the diaphragm and the substrate
Data Source
AI summary
The present invention provides a capacitance pressure sensor having a traces structure which can stably measure a pressure. A capacitance pressure sensor according to an embodiment of the present invention includes: a substrate having a first insulation layer to a third insulation layer; a diaphragm placed to face the substrate so that a reference chamber is formed between the diaphragm and the substrate; a first electrode on the substrate 1, facing to the diaphragm; a second electrode on the diaphragm, which is disposed so as to face the first electrode; a trace connected to the first electrode, for electrically connecting the first electrode to the outside; and a second trace connected to the second electrode, for electrically connecting the second electrode to the outside. The traces penetrate the first insulation layer from the reference chamber side of the substrate toward the side opposing to the reference chamber of the substrate, and also are bent between each of the insulation layers.


