Capacitive Barrier Layer for Parasitic Capacitance in Display Panels
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Solution Overview
Problem
In camera-under-panel (CUP) technology, the dense arrangement of leads in the CUP area leads to parasitic capacitance, causing uneven display and impacting the quality of the display panel.
Innovation Solution
A display panel design that includes a capacitive barrier layer with an organic insulating layer between the wiring layers, reducing parasitic capacitance and improving display uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are densely arranged to connect driving circuit to pixels in CUP area, then electrical connection is achieved, but parasitic capacitance increases causing uneven display
Solution Approach 1:
The patent introduces a capacitive barrier layer as an intermediary component between the first wiring layer and signal wiring layer. This barrier layer specifically targets and reduces parasitic capacitance at critical connection points without disrupting the electrical connection function of the leads.
Solution Approach 2:
The capacitive barrier layer is selectively positioned only where parasitic capacitance occurs (between overlapping wiring layers), rather than uniformly across the entire structure. This localized approach reduces harmful capacitance while preserving the electrical connection quality in other areas.
2Illumination intensity
If driving circuit is arranged at periphery of CUP area, then light transmittance is improved, but lead length and density increase causing parasitic capacitance
Solution Approach 1:
The capacitive barrier layer serves as a mediator that allows the peripheral arrangement of driving circuits (which improves light transmittance) to coexist with reduced parasitic capacitance. It compensates for the increased lead length and density effects by actively reducing capacitance at critical points.
3Reliability
If wiring layers are arranged to connect driving circuit and pixels, then electrical connection is established, but overlapping wiring layers generate parasitic capacitance
Solution Approach 1:
The capacitive barrier layer is positioned between overlapping wiring layers to reduce parasitic capacitance while allowing the layers to maintain their electrical connection functions. It acts as a mediator that reduces the harmful capacitive coupling without disrupting the necessary signal paths.
Solution Approach 2:
The barrier layer is specifically placed in regions where wiring layers overlap and parasitic capacitance occurs, rather than uniformly throughout the entire device. This localized intervention reduces capacitance at critical points while preserving electrical connection quality elsewhere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the capacitive barrier layer effectively reduces parasitic capacitance, leading to improved display uniformity and enhanced display quality in the CUP area.
Implementation Method 1
a capacitive barrier layer disposed between the first wiring layer and the signal wiring layer, wherein the capacitive barrier layer includes at least one organic insulating layer
Data Source
AI summary
A display panel and a display device are provided. The display panel includes a main display area, and display area(s) surrounded by the main display area. The display panel includes first light-emitting devices disposed in the display area(s); first pixel driving circuits disposed in the display area(s), and electrically connected to the first light-emitting devices respectively for driving the first light-emitting devices to emit light; a first wiring layer connected between first pixel driving circuits and first light-emitting devices; a signal wiring layer electrically connected to the first pixel driving circuits and partially overlapping the first wiring layer; and a capacitive barrier layer disposed between the first wiring layer and the signal wiring layer and including at least one organic insulating layer.