Capacitive Sensing Button IC Package for Simple PCB Replacement
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Solution Overview
Problem
Conventional mechanical buttons require significant layout changes to be replaced with capacitive touch-sensor buttons, which can complicate the integration of necessary components like sensor elements and grounding pads on a printed circuit board (PCB).
Innovation Solution
An integrated capacitive touch-sensor button is developed, where a ground pad and sensor element are attached within a single integrated circuit (IC) package, along with a capacitance sensor, minimizing the complexity of replacing mechanical buttons. This IC package includes a ground pin and an output pin for mounting on a PCB, with the output pin carrying a signal based on measured capacitance thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mechanical buttons are replaced with capacitive touch-sensor buttons, then the functionality is modernized and tactile feedback is eliminated, but the PCB layout complexity increases due to separate sensor elements and grounding pads
Solution Approach 1:
The patent combines the sensor element, grounding pad, and capacitive sensing circuitry into a single integrated circuit package. The IC contains the sensor element coupled to a capacitance sensor, with the grounding pad integrated within the same package, eliminating the need for separate PCB traces and reducing layout complexity while maintaining capacitive touch functionality
2Device complexity
If sensor elements and grounding pads are integrated into a single IC package, then PCB layout complexity is reduced, but the integration of multiple components within one package becomes more difficult
Solution Approach 1:
The patent implements a nested structure where the sensor element is positioned above the grounding pad within the IC package, with the capacitance sensor circuitry integrated beneath or around these elements. This nested arrangement allows multiple functional components to coexist in a compact footprint, facilitating integration while maintaining electrical isolation and functionality
3Ease of manufacture
If separate components are used for sensor element and grounding pad, then manufacturing is simpler, but the overall device size and PCB space requirements increase
Solution Approach 1:
The patent merges the sensor element, grounding pad, and capacitive sensing electronics into a single IC package, reducing the total component count and PCB footprint. The integrated design allows these functions to be implemented in a compact area while maintaining manufacturability through standard IC fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a seamless replacement of mechanical buttons with capacitive touch-sensor buttons, reducing the complexity of PCB layout changes and enabling efficient integration of capacitive sensing functionality.
Implementation Method 1
The capacitance detected by a capacitance sensor changes as a function of the proximity of a conductive object on the sensor element
Data Source
AI summary
An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.