Capacitive Chip-to-Chip-Carrier Connection Measurement
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Solution Overview
Problem
Conventional X-ray and Automatic Test Equipment (ATE) testing systems are inadequate in detecting defects in electrical connections, particularly 'near-short' wires, and have low detection capability and high costs for high pin count packages, failing to identify anomalies such as near-short wires, vertically displaced, sagging, or horizontally displaced wires.
Innovation Solution
A measuring device with a power supply, chip arrangement receiving portion, and detection portion including a plate and detection circuit configured to detect electrical signals, where the plate covers part of the chip arrangement and at least one chip-carrier connection is electrically connected, allowing for capacitive measurements to identify anomalies in chip-to-chip-carrier connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional X-ray detection systems are used for faulty electrical connections, then simple wire bond packages can be tested, but detection capability is low and throughput is very slow
Solution Approach 1:
The patent replaces the mechanical/optical X-ray detection system with an electrical measurement system. The measuring device uses electrical signals and capacitance measurements to detect connection faults, substituting the mechanical X-ray imaging process with electrical field interactions and signal analysis, thereby achieving both high detection capability and throughput
Solution Approach 2:
The patent changes the measurement parameter from physical structure (X-ray imaging of connection geometry) to electrical property (capacitance and signal response). By measuring electrical parameters such as capacitance values and signal transmission characteristics, the system can detect faults in chip-to-chip-carrier connections with high precision and speed
2Measurement precision
If conventional ATE testing systems are used, then electrical connections can be tested, but near-short wires and anomalies like vertically displaced wires cannot be detected
Solution Approach 1:
The patent introduces an intermediary measurement approach using capacitance as a mediator parameter. Instead of directly observing the physical connection geometry or relying solely on electrical continuity tests, the system uses capacitance measurements as an intermediary that reflects the physical state of connections, enabling detection of near-short wires and displacement anomalies
Solution Approach 2:
The patent substitutes conventional electrical continuity testing with electrical field-based capacitance measurement. By measuring the capacitance between conductive elements and reference points, the system can detect subtle anomalies such as near-short wires and vertically displaced connections that conventional ATE testing cannot detect
3Adaptability or versatility
If X-ray inspections are used for high pin count packages, then connection testing is possible, but the process becomes increasingly complex and expensive
Solution Approach 1:
The patent segments the measurement process into discrete, manageable steps. The measuring device systematically tests individual chip-to-chip-carrier connections by applying electrical signals and measuring capacitance values at specific locations, dividing the complex high pin count package testing into separate measurable units that can be processed individually
Solution Approach 2:
The patent replaces the complex X-ray imaging system with a simplified electrical measurement system. Instead of requiring complex X-ray equipment and image processing for high pin count packages, the system uses electrical signals and capacitance measurements that can be performed with simpler, more cost-effective test equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the detection of small interconnect defects and anomalies like wire sweep and horizontal displacement, improving the sensitivity and accuracy of detecting coupling capacitance, thereby identifying issues that conventional methods miss.
Implementation Method 1
the detection circuit is configured to detect an electrical signal from the plate... allowing for capacitive measurements that indicate anomalies in chip-to-chip-carrier connections
Data Source
AI summary
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a plurality of chip-to-chip-carrier connections; a detection portion including: a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of the chip arrangement; and wherein at least one chip-carrier connection is in electrical connection with the plate.