Capacitive Conductor Coupling for Thermal Expansion
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Solution Overview
Problem
Existing RF systems face challenges in achieving reliable and cost-effective conductor coupling, particularly on printed circuit boards (PCBs), due to thermal expansion and contraction issues, which can damage soldered connections and mechanical fastening methods, leading to signal loss and interference.
Innovation Solution
A conductor coupling apparatus utilizing a conductive coupling member separated by dielectric material, supported by resilient means that allows for slidable movement, providing capacitive coupling while avoiding mechanical fastening, thus accommodating thermal expansion and contraction without damaging the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldered connections are used to couple RF system components, then electrical connection is achieved, but manufacturing time increases and manufacturing costs increase
Solution Approach 1:
The patent replaces the mechanical soldering process with a capacitive coupling mechanism consisting of a conductive coupling member and dielectric material. This substitution eliminates the need for thermal processes and mechanical fastening, thereby reducing manufacturing time and costs while maintaining connection reliability through electrical field coupling rather than physical bonding.
Solution Approach 2:
The patent introduces a conductive coupling member separated by dielectric material as an intermediary between conductors. This intermediary structure enables electrical coupling through capacitance without requiring direct physical contact or soldering, thus improving manufacturing efficiency while preserving connection reliability.
2Reliability
If soldered connections are used to couple RF system components, then electrical connection is achieved, but thermal expansion and contraction damage the soldered connections
Solution Approach 1:
The patent replaces the mechanical soldered joint with a capacitive coupling system that does not rely on physical bonding. The conductive coupling member and dielectric material structure allows thermal expansion and contraction without generating the stress and heat that damage soldered connections, thereby eliminating thermal damage while maintaining connection reliability.
Solution Approach 2:
The dielectric material acts as an intermediary that isolates the conductive coupling member from direct thermal stress transfer between conductors. This intermediary structure absorbs and distributes thermal expansion forces, preventing the concentrated stress that causes solder joint failure while preserving electrical coupling reliability.
3Stability of the object's composition
If mechanical fastening elements are used to couple RF system components, then structural stability is achieved, but the rigid connection damages connections during thermal expansion and contraction
Solution Approach 1:
The patent replaces the static rigid mechanical fastening with a dynamic capacitive coupling system. The conductive coupling member can move relative to the conductors while maintaining electrical coupling through the dielectric material, allowing the system to adapt to thermal expansion and contraction dynamically without causing damage, thus preserving both mechanical stability and connection durability.
Solution Approach 2:
The dielectric material serves as an intermediary that decouples the mechanical stability function from the electrical coupling function. This allows the conductive coupling member to maintain stable electrical coupling while being mechanically isolated from the conductors, enabling thermal movement without damaging the connection.
4Stability of the object's composition
If thick metal strips and screw connections are used for coupling, then mechanical stability is achieved, but the solution is not suitable for thin PCBs and screws can get damaged due to thermal deformation
Solution Approach 1:
The patent replaces the bulky mechanical fastening system (thick metal strips and screws) with a compact capacitive coupling structure. This substitution provides sufficient mechanical stability through the conductive coupling member and dielectric material assembly while being thin enough to accommodate PCBs of various thicknesses, thereby improving adaptability without sacrificing stability.
Solution Approach 2:
The patent changes the fundamental coupling mechanism from mechanical (screws and metal strips) to electrical (capacitive coupling). This parameter change enables the system to achieve mechanical stability through electrical field interaction rather than physical fastening, making it compatible with thin PCBs while avoiding the thermal deformation issues that plague screw connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable capacitive coupling with improved mechanical stability, reducing signal interference and maintaining connection quality across temperature changes without the need for soldering or mechanical fastening, thereby enhancing the durability and efficiency of RF systems.
Implementation Method 1
the conductive coupling member is configured to provide a capacitive coupling between the first conductor and the second conductor
Implementation Method 2
the RF system components are prone to thermal expansion and thermal contraction
Implementation Method 3
the at least one second support member is or comprises at least one resilient means
Data Source
Figure 1a~1b
Figure 2
Figure 3
AI summary
The invention provides a conductor coupling apparatus 100a. The conductor coupling apparatus 100a comprises a conductive coupling member 103 configured to cover a portion 101p of a first conductor 101 and a portion 102p of a second conductor 102. The conductive coupling member 103 is further configured to be separated from the first conductor 101 and/or the second conductor 102 by dielectric material 104a, wherein the conductive coupling member 103 is configured to provide a capacitive coupling between the first conductor 101 and the second conductor 102. The conductor coupling apparatus 100 further comprises at least one first support member 105a, configured to press the conductive coupling member 103 towards the first conductor 101 and/or the second conductor 102 whereby the conductive coupling member 103 is secured slidably against the first conductor 101 and the second conductor 102.