Capacitive Electrical Connection Assembly for Stable Mobile Grounding
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Solution Overview
Problem
The issue of unstable surface contact resistance in electrical connections between electronic components in mobile terminals, leading to radiated spurious emission (RSE) and reduced grounding effectiveness, particularly in components with overlapping installations, is addressed.
Innovation Solution
An electrical connection assembly is implemented using a conductive component with a first insulation layer, forming a capacitor with the first component to enable non-contact coupling and stable signal transmission, eliminating the need for direct contact and costly conductive coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If direct contact electrical connection is used between electronic components, then simple structure is achieved, but unstable contact resistance causes RSE and reduces grounding effectiveness
Solution Approach 1:
The patent introduces an insulation layer as an intermediary between the conductive surfaces of the first and second components. This insulation layer has a controlled thickness (0.01-0.05mm) that enables capacitive coupling while blocking direct electrical contact. The insulation layer acts as a mediator that maintains stable electrical connection characteristics by preventing the unstable contact resistance that occurs with direct surface contact, thereby resolving the RSE issue while maintaining a relatively simple overall structure.
Solution Approach 2:
The patent replaces the mechanical direct contact electrical connection system with a capacitive coupling system. Instead of relying on physical surface contact between conductive components, the invention uses an electric field through the insulation layer to transmit signals. This substitution eliminates the mechanical contact instability that causes RSE, achieving reliable grounding and electrical connection without the need for stable mechanical contact.
2Reliability
If conductive coating is applied to improve contact resistance, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and removes the need for conductive coatings from the electrical connection system. By introducing the insulation layer that enables capacitive coupling, the invention eliminates the requirement for additional conductive layers or coatings on the component surfaces. This extraction of the coating requirement directly reduces manufacturing steps and costs while maintaining or improving electrical connection reliability through the capacitive coupling mechanism.
Solution Approach 2:
The insulation layer serves as a simple, thin, and cost-effective solution that replaces expensive conductive coatings. The insulation layer can be made from inexpensive materials and applied as a thin film (0.01-0.05mm), providing a disposable-like simplicity in terms of manufacturing. This approach uses a cheap, easily manufactured component to achieve the reliability that would otherwise require costly conductive coatings.
3Manufacturing precision
If insulation layer with larger thickness is used, then manufacturing precision requirement is reduced, but capacitance decreases affecting signal coupling
Solution Approach 1:
The patent optimizes the insulation layer thickness parameter to a specific range (0.01-0.05mm) that balances manufacturing precision requirements with electrical performance. This parameter selection ensures that the capacitance remains sufficient for effective signal coupling while not being so thin as to require extremely high manufacturing precision. The specified thickness range represents an optimal compromise that satisfies both manufacturing capabilities and electrical performance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances electrical connection reliability, reduces RSE, and lowers manufacturing costs by avoiding direct contact and unnecessary conductive coatings, while maintaining effective grounding.
Implementation Method 1
a capacitor is formed between the conductive component and the first component having the non-ideal conductive surface. In this way, a signal of the first component having the non-ideal conductive surface may be coupled to the conductive component by using the capacitor
Data Source
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AI summary
Embodiments of this application provide an electrical connection assembly and a mobile terminal, and relate to the field of electronic communications technologies, to resolve a problem that an electrical connection point between an electronic component and a surface with unstable resistance is in unstable contact. The electrical connection assembly includes a first component, a second component, a conductive component, and a first insulation layer. The first component and the second component each have a conductive surface. The conductive surface of the first component is disposed opposite to the conductive surface of the second component. The conductive component is located between the first component and the second component. The first insulation layer is disposed on the conductive surface of the first component. The conductive component is in contact with the first insulation layer. The conductive component is electrically connected to the conductive surface of the second component.