Capacitively Coupled Connector S-Bend RF Isolation
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Solution Overview
Problem
Coaxial connectors face issues with Passive Intermodulation Distortion (PIM) due to asymmetrical interconnections and mechanical stress, which degrades RF system performance, and existing blind mate connectors are complex and costly to manufacture and install.
Innovation Solution
A capacitively coupled blind mate coaxial connector interface with conical mating surfaces and dielectric spacers for capacitive coupling, reducing direct electrical contact and incorporating an S-bend for RF isolation, along with RF absorbing materials to minimize PIM and simplify assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct electrical contact is used in connector interfaces, then electrical connection is achieved, but Passive Intermodulation Distortion (PIM) increases and RF system performance degrades
Solution Approach 1:
The patent introduces dielectric spacers as intermediary elements between the inner conductor and outer conductor of the coaxial connector. These spacers physically separate the conductors, preventing direct electrical contact while maintaining the structural integrity and electrical function of the connector through capacitive coupling, thereby reducing PIM generation
Solution Approach 2:
The patent replaces the traditional mechanical contact-based electrical connection with a capacitively coupled interface. Instead of relying on direct metal-to-metal contact, the connector uses electric field coupling through the dielectric spacers, substituting a mechanical system with an electromagnetic field-based system that reduces PIM
2Ease of operation
If blind mate connector design is implemented to enable push-on interconnection, then ease of operation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes complex alignment mechanisms and precision mechanical features from the connector design. By extracting these unnecessary components and relying on the inherent robustness of the capacitively coupled interface, the design achieves blind mate functionality with simpler construction and lower manufacturing costs
Solution Approach 2:
The connector design enables self-alignment and self-connection through its geometric features and capacitive coupling mechanism. The blind mate capability is achieved without requiring complex external alignment aids or precision machining, as the connector components guide themselves into proper engagement through their own structural characteristics
3Ease of manufacture
If symmetric interconnection is used in connector design, then manufacturing is simplified, but PIM resistance is reduced due to asymmetrical stress and vibration effects
Solution Approach 1:
The patent intentionally introduces asymmetric features into the connector design, specifically the strategically positioned dielectric spacers that create an asymmetric electrical field distribution. This asymmetric configuration counteracts the asymmetric mechanical stresses and vibrations that occur during operation, thereby reducing PIM generation while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces PIM by eliminating direct electrical contact and enhancing RF isolation, improving the reliability and cost-effectiveness of coaxial connector interfaces while maintaining quick-connect functionality.
Implementation Method 1
a first capacitive interface comprising a first conductive surface of the first connector and a second conductive surface of the second connector, each spaced apart from the other by a dielectric spacer
Implementation Method 2
incorporating an S-bend for RF isolation
Implementation Method 3
along with RF absorbing materials to minimize PIM
Data Source
AI summary
A connector with a capacitively coupled connector interface for interconnection with a female portion is provided with an annular groove, with a sidewall, open to an interface end of the female portion. A male portion is provided with a male outer conductor coupling surface at an interface end, covered by an outer conductor dielectric spacer. A waveguide path between the male outer conductor coupling surface and the female portion, while in the interlocked position, may extend from the outer conductor dielectric spacer to an exterior of the interconnection through an s-bend in a radial direction, to improve RF isolation. Alternatively and/or additionally an overbody may be provided as an RF absorbing chamber including RF absorbing material and which may include a plurality of RF absorbing chambers isolated from one another, where multiple interconnections are present.