Capacitive Coupled Resonators for High Frequency Galvanic Isolators
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Solution Overview
Problem
Conventional isolators fail to operate at high frequencies with both high bandwidth and sufficient isolation, often sacrificing either transfer efficiency or isolation rating due to the spacing and coupling of inductors.
Innovation Solution
The development of integrated isolator devices with conductive plates and traces configured for resonance and capacitance, allowing for high-frequency operation with high bandwidth and isolation while maintaining a small substrate footprint, using galvanic isolation and capacitive coupling to achieve desired characteristic impedance and efficient energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional isolators use inductor coupling to provide isolation between circuits, then galvanic isolation is achieved, but the isolator cannot operate at high frequencies with both high bandwidth and sufficient isolation rating
Solution Approach 1:
The patent changes the fundamental coupling parameter from inductive coupling to capacitive coupling. By using capacitive coupling between isolated circuits, the isolator achieves high-frequency operation (up to 200 GHz) while maintaining both high bandwidth and sufficient isolation rating, resolving the trade-off that limited conventional inductor-based isolators
Solution Approach 2:
The patent replaces the traditional inductor-based magnetic coupling mechanism with a capacitor-based electric field coupling mechanism. This substitution enables operation at much higher frequencies since capacitive coupling has lower parasitic effects at high frequencies compared to inductive coupling, while still providing the necessary galvanic isolation
2Reliability
If conventional isolators increase isolation rating, then better circuit isolation is achieved, but transfer efficiency deteriorates
Solution Approach 1:
By changing from inductive to capacitive coupling, the patent achieves a different performance characteristic where both isolation rating and transfer efficiency can be simultaneously optimized. The capacitive coupling structure allows for high isolation ratings while maintaining low energy loss through proper impedance matching and resonance design
3Speed
If conventional isolators are designed for high frequency operation, then operating frequency increases, but substrate footprint increases
Solution Approach 1:
The patent utilizes vertical stacking of capacitive structures to achieve high-frequency operation without proportionally increasing the substrate footprint. By implementing capacitive coupling in a compact, vertically-integrated manner, the isolator achieves 200 GHz operation with minimal area occupation compared to conventional planar inductor-based designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The isolator devices achieve high transfer efficiency and isolation ratings at frequencies up to 200 GHz with minimal substrate usage, effectively addressing the limitations of conventional isolators by optimizing the configuration of conductive plates and traces for resonance and impedance.
Implementation Method 1
The isolators may include isolator components galvanically isolated from and capacitively coupled to each other
Implementation Method 2
The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation
Data Source
AI summary
Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.