Capacitive Coupled High Frequency Band Pass Filter
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Solution Overview
Problem
Conventional high frequency surface mounted band pass filters suffer from undesirable spurious modes due to vertical conductive structures, which degrade performance and are costly to manufacture, especially at frequencies above 30 GHz.
Innovation Solution
A high frequency band pass filter design that eliminates vertical conductive structures by using capacitive coupling between signal connection elements on one surface of the filter substrate and circuit connection elements on the opposed surface, preventing the launch of parasitic modes and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical conductive structures are used to connect signal connection elements to circuit connection elements, then electrical connection is achieved, but spurious modes are launched degrading filter performance
Solution Approach 1:
The patent removes vertical conductive structures (via holes, metallized posts) from the filter design entirely. Instead of using these traditional connection methods, the invention employs capacitive coupling between signal connection elements on one surface and circuit connection elements on the opposite surface, thereby eliminating the source of spurious mode generation while maintaining electrical connectivity.
Solution Approach 2:
The patent introduces a capacitive coupling mechanism as an intermediary between signal connection elements and circuit connection elements. This capacitive coupling serves as a mediator that transfers electrical signals without requiring direct physical contact through vertical conductors, thus avoiding the launch of parasitic modes into the substrate.
2Reliability
If vertical conductive structures are used for connection, then electrical connectivity is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent eliminates the need for complex vertical conductive structures such as via holes, metallized posts, and associated fabrication processes. By using capacitive coupling through the substrate, the design removes these manufacturing complexities while maintaining reliable electrical connectivity between surfaces.
3Object-generated harmful factors
If capacitive coupling is used instead of vertical conductive structures, then spurious mode coupling is prevented, but connection reliability must be maintained
Solution Approach 1:
The patent employs capacitive coupling as an intermediary mechanism that reliably transfers electrical signals between surfaces without the harmful effects of vertical conductors. The capacitive coupling provides sufficient signal integrity and connection reliability for high frequency applications while preventing spurious mode generation.
Solution Approach 2:
The patent replaces the mechanical/physical contact-based vertical conductive structures with an electromagnetic field-based capacitive coupling mechanism. This substitution eliminates mechanical connections that launch spurious modes while maintaining effective electrical signal transmission through electric field coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents spurious mode coupling, enhancing filter performance and reducing manufacturing complexity and costs by achieving efficient electromagnetic coupling without vertical conductive structures, thereby improving consistency and reducing operational issues at high frequencies.
Implementation Method 1
capacitive coupling between signal connection elements on one surface of the filter substrate and circuit connection elements on the opposed surface
Implementation Method 2
electromagnetic coupling between signal connection elements on one surface of the filter substrate and circuit connection elements on the opposed surface
Data Source
AI summary
A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.