Capacitive Signal Coupling in Flexible Electronic Modules

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Wearable electronic devices face reliability issues due to damage from rigid structures like dielectric layers and molding compounds over flexible substrates, and traditional cable connections suffer from metal fatigue, reducing device reliability.

Innovation Solution

A flexible electronic module design featuring sub-modules with electrodes forming capacitors for AC signal transmission between modules, eliminating the need for cables and protecting against structural damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional cable connections are used to transmit signals between modules, then signal transmission is achieved, but metal fatigue occurs reducing device reliability

Engineering Contradiction:

Improvedevice reliabilityVSAvoidcable service life

Core Design Contradiction:

ReliabilityVSDuration of action of moving object

Solution Approach 1:

The patent extracts and eliminates the cable connection component from the system by implementing direct capacitive coupling between adjacent electronic modules. The electrodes on adjacent modules form capacitors that enable AC signal transmission without physical cables, thereby removing the source of metal fatigue and improving reliability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces capacitors formed by adjacent electrodes as an intermediary mechanism for signal transmission. These capacitors enable AC coupling between modules without requiring direct physical contact or cable connections, allowing signal transmission while avoiding metal fatigue issues

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If rigid structures like dielectric layers and molding compounds are disposed over flexible substrates, then structural support is provided, but the flexible substrate and its components may be damaged

Engineering Contradiction:

Improvestructural supportVSAvoidstructural damage risk

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent divides the electronic device into separate flexible modules that can move independently. Each module contains its own components and electrodes, allowing the flexible substrate to bend and flex without stress concentration points that would occur with rigid structures, thereby preventing structural damage

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs entirely flexible construction for both the substrate and module packaging, eliminating rigid dielectric layers and molding compounds. The flexible encapsulation maintains structural integrity while allowing natural flexing of the substrate, preventing damage from rigid constraints

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If capacitors are used for AC signal transmission between modules, then cable breakage is prevented, but device complexity increases

Engineering Contradiction:

Improvesignal transmission reliabilityVSAvoidmodule structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the signal transmission function with the module packaging structure itself. The electrodes are integrated into the module housing or substrate, and adjacent modules form capacitors through their proximity, eliminating the need for separate capacitor components and reducing overall device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The module packaging structure serves multiple functions: it provides mechanical protection, enables AC signal transmission through capacitive coupling, and facilitates heat dissipation. This multi-functionality reduces the need for additional components, thereby reducing device complexity while maintaining reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the flexibility and reliability of wearable electronic devices by using capacitors for signal transmission, reducing the risk of malfunction from cable breakage and providing protection against damage and contamination.

Implementation Method 1

The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS10483254B2Electronic module and semiconductor package device

Publication Date: 2019.11.19 ADVANCED SEMICON ENG INC

AI summary

An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module.