Capacitive Coupling on Flexible Substrates for Transparent Interconnects

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Solution Overview

Problem

Existing electronic component manufacturing on non-flexible substrates requires through-holes or vias for conductive interconnects, which can lead to material degradation and limitations in flexibility and transparency.

Innovation Solution

A flexible substrate-based apparatus with input and output electrodes forming capacitors to enable input and output signals without galvanic contacts, allowing for flexible and transparent electronic components with graphene or other 2D materials, and integration of capacitance touch sensors and variable resistor sensors for sensing applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through-holes or vias are used for conductive interconnects between layers, then galvanic connection is achieved, but material degradation occurs and flexibility and transparency are limited

Engineering Contradiction:

Improvegalvanic connectionVSAvoidmaterial degradation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces capacitive coupling as an intermediary mechanism between layers, replacing direct galvanic connections through through-holes. The capacitor consists of first and second electrodes separated by a dielectric layer, enabling signal transmission without direct material contact, thus preventing material degradation while maintaining electrical connection functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical/physical through-hole structure with an electromagnetic field-based capacitive coupling system. Instead of relying on physical conductive paths through the substrate, the invention uses electric fields across a dielectric to transmit signals, eliminating the need for material removal and associated degradation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If through-holes or vias are used for conductive interconnects, then galvanic connection is achieved, but flexibility is limited

Engineering Contradiction:

Improvegalvanic connectionVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The dielectric layer acts as a flexible intermediary between capacitor electrodes, allowing the structure to bend and deform without creating direct conductive paths that would restrict flexibility. This capacitive coupling mechanism maintains electrical connection while accommodating mechanical deformation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs thin-film capacitor structures with flexible dielectric materials that can be integrated into flexible substrates. The capacitor electrodes and dielectric form a thin, flexible assembly that maintains electrical functionality while allowing the overall device to bend and conform to different shapes

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If through-holes or vias are used for conductive interconnects, then galvanic connection is achieved, but transparency is limited

Engineering Contradiction:

Improvegalvanic connectionVSAvoidtransparency

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

The dielectric layer serves as a transparent intermediary that allows light transmission while maintaining electrical isolation between capacitor electrodes. This eliminates the need for opaque through-holes and conductive fill materials, preserving optical transparency while achieving electrical connection functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention replaces the opaque mechanical through-hole structure with a transparent electromagnetic field-based capacitive coupling system. The electric field can penetrate transparent dielectric materials, allowing signal transmission without blocking light, thus maintaining device transparency

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible and transparent electronic components that prevent material degradation, support flexible displays, and allow for simultaneous detection of touch and other parameters like strain or chemical presence without direct contact, enhancing sensing capabilities.

Implementation Method 1

a first input electrode, supported by the flexible substrate and configured to form a first capacitor with a second input electrode and to provide an input to the component

Methodology Applied

Scientific EffectCapacitance: Capacitance

Implementation Method 2

a first output electrode, supported by the flexible substrate and configured to form a second capacitor with a second output electrode and to provide an output from the component

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS9366708B2Apparatus comprising a flexible substrate and a component supported by the flexible substrate

Publication Date: 2016.06.14 NOKIA TECHNOLOGIES OY

AI summary

An apparatus including a flexible substrate; a component supported by the flexible substrate; a first input electrode, supported by the flexible substrate and configured to form a first capacitor with a second input electrode and to provide an input to the component; and a first output electrode, supported by the flexible substrate and configured to form a second capacitor with a second output electrode and to provide an output from the component.