Capacitive Coupling for Integrated Circuit Contactless Connection
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Solution Overview
Problem
Existing methods for connecting integrated circuits to antennas in contactless and dual-function objects often require modifications to the chip design and result in suboptimal use of the chip's capabilities, limited spacing between capacitive coupling components, and increased manufacturing costs.
Innovation Solution
The method involves positioning capacitive coupling contact plates on a surface facing away from the integrated circuit, using conductive plates arranged between substrate layers and a PVC support to achieve capacitive coupling without modifying the chip, allowing for a thinner thickness and larger metal surfaces for enhanced capacitance, and using standard electronic circuits without adaptation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact plates are positioned close to the integrated circuit to achieve capacitive coupling, then coupling efficiency is improved, but spacing control is limited by the need for physical stops
Solution Approach 1:
The invention extracts the spacing control function from mechanical stops and relocates it to the dielectric layer thickness. By controlling the thickness of the dielectric layer between the contact plates and the integrated circuit, precise spacing is achieved without requiring additional mechanical stop structures, thereby simplifying the device while maintaining coupling efficiency
Solution Approach 2:
The dielectric layer serves as an intermediary element that simultaneously provides electrical insulation and precise spacing control. By positioning the contact plates on the dielectric layer, the invention achieves controlled capacitive coupling without direct mechanical contact, eliminating the need for complex stop mechanisms
2Reliability
If the last layer of the chip is used for contact pads to enable capacitive coupling, then connection is achieved, but all chip capacities cannot be exploited
Solution Approach 1:
The invention segments the chip layers by using intermediate layers (not the last layer) for contact pads. This allows the last layer to be dedicated to active circuit functions while intermediate layers provide connection interfaces, enabling full utilization of chip capacities without compromising connection capability
Solution Approach 2:
The invention moves the contact pad functionality from the final surface layer to intermediate layers within the chip structure. This dimensional repositioning allows simultaneous optimization of both connection capability (through dedicated intermediate layers) and active circuit performance (by preserving the last layer for signal processing)
3Ease of manufacture
If standard electronic circuits are used without adaptation, then manufacturing cost is reduced, but connection to antenna requires additional capacitive coupling structures
Solution Approach 1:
The invention merges the capacitive coupling function with the existing antenna structure by positioning contact plates on the same substrate as the antenna. This integration allows standard electronic circuits to be used without adaptation while the coupled antenna structure provides the necessary capacitive connection, avoiding additional complex structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient capacitive coupling with higher capacitance values, reducing manufacturing costs and extending the card's lifespan by minimizing parasitic capacitance and avoiding physical connections, while maintaining the chip's original design and using standard manufacturing processes.
Implementation Method 1
The integrated circuit is connected via electrical means to at least two first conductive plates on a surface of the substrate of the module. The electrical circuit comprises an antenna placed on a support and connected to at least two second conductive surfaces. The two conductive surfaces arranged opposite one another form a capacitive coupling.
Data Source
Figure 1~2A
Figure 2B~4A
Figure 4B~5
AI summary
The invention relates to a contact and contactless portable object and to a method for connecting an integrated circuit arranged on a substrate to an electrical circuit including at least the following steps in combination: • using at least one first conductive plate (3a, 3b) on a surface (2a) of the substrate (2) on which said integrated circuit (4) is connected; • using at least one second conductive plate (7a, 7b) on a carrier (20) including an electrical circuit (5); • the first conductive plate (3a, 3b) and the second conductive plate (7a, 7b) being arranged facing one another, their geometric and electrical characteristics and the distance between the two conductive plates being suitable for forming a capacitive coupling between the integrated circuit and the electrical circuit. The invention can be applied to the production of a contactless card.