Capacitive Coupling in Double PCB Antenna Structures
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Solution Overview
Problem
Deploying new active antenna systems, particularly for 5G operations, in densely populated urban areas is challenging due to complex and costly negotiations, and existing solutions using double-PCB structures with striplines suffer from unwanted resonance and passive intermodulation effects.
Innovation Solution
A capacitive coupling method using via-holes connected to conductive pads on both sides of the stripline in a double-PCB structure replaces end-to-end via-holes, suppressing leaky modes and reducing passive intermodulation effects, allowing for better RF performance and integration with lower band antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If end-to-end via-holes are used in double-PCB structures with striplines, then electrical connection is achieved, but unwanted resonance and passive intermodulation effects occur
Solution Approach 1:
The patent divides the continuous via-hole connection into separate segments: individual via-holes in the first PCB layer and individual via-holes in the second PCB layer, connected through capacitive coupling rather than a continuous conductive path. This segmentation breaks the resonant pathways while maintaining electrical connection functionality.
Solution Approach 2:
The patent introduces capacitive coupling as an intermediary element between the via-holes of the first and second PCB layers. This capacitive intermediary blocks the propagation of unwanted RF signals and resonances while allowing the necessary electrical connection for signal transmission, thereby reducing passive intermodulation effects.
2Adaptability or versatility
If new antennas are deployed in dense urban areas, then wireless service coverage is expanded, but negotiation complexity and deployment costs increase
Solution Approach 1:
The patent combines 5G New Radio (NR) antenna functionality with existing 4G LTE antenna structures by integrating the PCB structures and sharing the mast mounting infrastructure. This merging approach allows operators to deploy 5G services in dense urban areas without requiring completely separate antenna systems, thereby reducing negotiation complexity and deployment costs.
Solution Approach 2:
The antenna component is designed to support multiple frequency bands and wireless services (both 4G LTE and 5G NR) within a single integrated structure. This multi-functionality allows the same antenna system to serve multiple purposes, reducing the need for additional separate antenna deployments and simplifying site acquisition negotiations.
3Object-generated harmful factors
If capacitive coupling is used instead of end-to-end via-holes, then unwanted resonances are suppressed, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the electrical parameters of the PCB structure by introducing capacitive coupling between via-holes, changing the impedance characteristics and resonance behavior of the structure. This parameter change suppresses unwanted resonances while the capacitive coupling can be implemented using standard PCB fabrication techniques, keeping manufacturing complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capacitive coupling solution effectively suppresses unwanted resonances and interferences, improving RF performance and reducing passive intermodulation, enabling efficient deployment of 5G antennas while minimizing interference with existing radio networks.
Implementation Method 1
at least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration
Implementation Method 2
each via hole being electrically conductive and being connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface thereof
Data Source
AI summary
An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.