Capacitive Coupling Pin Connection Testing System
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Solution Overview
Problem
Conventional capacitive-coupling testing methods struggle to accurately determine the connection state of high-density integrated circuits due to weakened capacitive coupling, leading to reduced testability and increased errors in ball grid array package manufacturing lines.
Innovation Solution
A testing system that includes a signal sensing unit, a signal processor unit with anti-alias filtering and over-sampling, and an analyzer unit to compute digital signals, which applies a validation test to adjust the frequency and amplitude of the testing signal to enhance the signal-to-noise ratio and correctly determine the connection state of tested pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional capacitive-coupling testing method is used, then testing process is simple and nondestructive, but signal-to-noise ratio is reduced due to miniaturization of lead frame dimensions
Solution Approach 1:
The patent changes the testing parameters by adjusting the frequency and amplitude of the testing signal dynamically. When capacitive coupling is weak, the system increases the signal frequency and amplitude to maintain adequate signal-to-noise ratio, thereby resolving the contradiction between simple testing process and reduced measurement precision.
Solution Approach 2:
The patent implements a feedback mechanism where the system continuously monitors the sensed signal strength and automatically adjusts the testing signal parameters accordingly. This feedback loop ensures that the testing process remains simple while maintaining measurement precision by adapting signal characteristics based on real-time coupling conditions.
2Reliability
If testing threshold is kept at conventional level (20 fF), then false determinations are reduced, but testing coverage is reduced for high-density packages
Solution Approach 1:
The patent makes the testing threshold dynamic rather than fixed. The system automatically adjusts the threshold based on the actual capacitive coupling strength detected during testing. For weakly coupled pins in high-density packages, the threshold is lowered to increase coverage, while for strongly coupled pins, a higher threshold maintains reliability and reduces false determinations.
Solution Approach 2:
The patent changes the threshold parameter dynamically based on signal strength and coupling conditions. This allows the system to adapt the acceptance criteria for connection state determination to match the actual testing conditions, thereby increasing overall testing coverage while maintaining accuracy.
3Quantity of substance
If lead frame dimensions are reduced for miniaturization, then integrated circuit density is increased, but capacitive coupling between lead frame and sensor plate is weakened
Solution Approach 1:
The patent compensates for the reduced capacitive coupling caused by miniaturization by dynamically changing the testing signal parameters. The system increases frequency and amplitude when coupling is weak, effectively decoupling the measurement precision from the physical dimensions of the lead frame.
Solution Approach 2:
The patent uses high-frequency alternating signals that create oscillating electric fields. This vibrational approach enhances the capacitive coupling effect dynamically, allowing the system to overcome the reduced static coupling caused by miniaturization through frequency-dependent field enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces errors in determining the connection state by increasing the signal-to-noise ratio and improving testability, allowing for accurate assessment of even weakly coupled pins, with a lower testing threshold and enhanced coverage.
Implementation Method 1
use capacitive coupling for determining the connection state of a tested pin
Data Source
AI summary
The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin.