Capacitive Input Electrode Stack for Resolution and Cost Balance
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Solution Overview
Problem
Existing capacitance type input devices face challenges in reducing costs while maintaining appropriate layer configurations for electrodes and ensuring insulation, particularly in the formation of conductive layers and circuit wiring layers.
Innovation Solution
The capacitance type input device employs a stacked structure for the detection electrode using a second conductive layer with lower resistance and a third conductive layer with higher resistance than the first conductive layer for the driving electrode, along with a ground layer and circuit wiring layer configuration that uses different conductive materials to optimize costs and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer conductive structure is used for electrodes, then manufacturing process is simpler, but detection resolution and signal quality deteriorate
Solution Approach 1:
The detection electrode is segmented into multiple conductive layers (second conductive layer and third conductive layer) with different resistance values. This segmentation allows each layer to contribute differently to the capacitance detection, improving measurement precision while maintaining a manageable manufacturing process through sequential layer formation.
Solution Approach 2:
The electrode structure uses composite conductive layers with different resistance characteristics. The second conductive layer has lower resistance than the first conductive layer, while the third conductive layer has higher resistance than the second. This composite structure optimizes both signal detection quality and manufacturing considerations.
2Ease of manufacture
If high-resistance conductive material is used to reduce costs, then manufacturing cost decreases, but voltage drop increases affecting detection accuracy
Solution Approach 1:
Different regions of the electrode structure have different resistance characteristics tailored to their specific functions. The second conductive layer uses lower resistance material where current flow is significant to minimize voltage drop, while the third conductive layer uses higher resistance material where cost reduction is prioritized. This local differentiation optimizes both performance and cost.
Solution Approach 2:
The resistance parameter of the conductive layers is changed across different layers rather than using a uniform resistance value. The second conductive layer has lower resistance than the first, and the third has higher resistance than the second, creating an optimized resistance profile that balances voltage drop minimization with manufacturing cost reduction.
3Reliability
If insulating layer thickness is increased to ensure insulation, then insulation reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of uniformly increasing insulating layer thickness throughout the entire device, the patent applies insulation selectively where it is most critical for preventing short circuits. The insulating layer configuration is optimized to provide sufficient insulation reliability only in regions where electrical isolation is necessary, reducing unnecessary manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the detection resolution and reduces manufacturing costs by optimizing the electrical resistance and material usage in the electrodes and insulating layers, ensuring effective capacitance detection and insulation without significant voltage drop.
Implementation Method 1
detects a change in capacitance between the input device and the first driving electrode by using the detection electrode
Data Source
AI summary
A detection electrode and an X-driving electrode (first driving electrode) are stacked through a sensor side insulating layer, at the side of a sensor portion of a film base material, and a Y-driving electrode (second driving electrode) is formed on the same forming surface as the detection electrode. The X-driving electrode is formed of a first conductive layer, the detection electrode and the Y-driving electrode are formed in a stacked structure of a second conductive layer having a resistance lower than the first conductive layer and a third conductive layer having a resistance higher than the first conductive layer and the second conductive layer.