Capacitive Fingerprint Module Layout for Compact Mobile Integration
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Solution Overview
Problem
Existing fingerprint identification apparatuses are bulky, complex, and costly, with poor sensitivity and high production costs, and are prone to malfunctions due to finger stains or copied fingerprints, and have low production yield and efficiency.
Innovation Solution
A compact fingerprint identification apparatus with an integrated sensing and control circuit on a base plate, supported by a conductor holder and covered with a dielectric sheet, which reduces the structure and facilitates assembly into mobile terminals, enhancing sensitivity and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional fingerprint identification apparatus structure is used, then fingerprint identification function is achieved, but the structure is large and complex
Solution Approach 1:
The patent merges the sensing circuit and control circuit into a single integrated module mounted on one base plate. The sensing circuit includes sensing electrodes arranged in an array, while the control circuit processes signals from these electrodes. By combining these previously separate components into one unified structure, the overall device volume is reduced and packaging complexity is simplified, directly resolving the technical contradiction between compact size and structural complexity.
2Reliability
If finger swipe type is used, then fingerprint identification is achieved, but sensitivity is poor and easily cracked by fingerprint copy
Solution Approach 1:
The patent replaces traditional optical imaging methods with an electrical field-based sensing system. Multiple sensing electrodes are arranged in an array pattern, creating electrical fields that interact with the fingerprint's moisture and conductivity characteristics. This electrical field approach is more sensitive to genuine fingerprint properties and harder to replicate with simple fingerprint copies, thereby improving both sensitivity and security against spoofing attacks.
3Ease of manufacture
If conventional packaging process is used, then module is assembled, but cost is high and production yield is low
Solution Approach 1:
The patent segments the fingerprint identification apparatus into distinct functional modules: the sensing circuit module with sensing electrodes on the base plate, the control circuit module, and the conductor holder component. This modular segmentation allows each module to be manufactured and tested independently, then assembled together using standardized connection interfaces. This approach simplifies the packaging process, reduces manufacturing costs, and improves production yield by enabling parallel manufacturing and easier defect isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a high-sensitivity, accurate, and cost-effective fingerprint identification system with improved production efficiency and yield, suitable for mobile terminals, offering enhanced security and convenience.
Implementation Method 1
the sensing circuit collects fingerprints through the dielectric cover sheet pressed by a finger and generates an analog signal
Data Source
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AI summary
The present disclosure discloses a fingerprint identification apparatus and a mobile terminal using the same. The fingerprint identification apparatus includes: a fingerprint identification module, including a sensing circuit, a control circuit and a base plate, wherein the sensing circuit is arranged on the base plate via a support member and electrically connected to the base plate, and the control circuit is electrically connected to the base plate and located beneath the sensing circuit. a conductor holder, the conductor holder being provided with a through hole, covering the fingerprint identification module and electrically connected to the base plate; and a dielectric cover sheet, the dielectric cover sheet being assembled in the through hole and connected to the sensing circuit.