Capacitive Ground Coupling for Metal Housing Leakage Current

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Solution Overview

Problem

Electronic devices with metal housings face issues with stable ground connections due to leakage currents and differing ground potentials among multiple circuit boards, affecting antenna performance and noise tolerance.

Innovation Solution

Incorporating a conductive support member with capacitive coupling between circuit boards and a ground structure comprising a non-conductive and conductive layer to establish a stable ground potential across all circuit boards, ensuring equal ground potential and improved noise tolerance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal housing is used for aesthetic impression or hardness, then the appearance and structural strength are improved, but leakage current occurs and stable ground connection becomes difficult

Engineering Contradiction:
Improvestructural strengthVSAvoidground connection stability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

A conductive member is introduced as an intermediary between the metal housing and circuit boards. This conductive member forms capacitive coupling with the metal housing through a non-conductive layer, allowing ground potential stabilization without direct electrical contact that would cause leakage currents. The intermediary structure enables indirect grounding while maintaining the metal housing's structural integrity and aesthetic properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If grounds of multiple circuit boards are connected only by a connection member, then the structure is simple, but different ground potentials occur and stable ground connection is difficult to implement

Engineering Contradiction:
Improveground connection structureVSAvoidground potential stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The conductive member is electrically connected to grounds of multiple circuit boards (first circuit board and second circuit board) to establish equipotential conditions. By forming capacitive coupling with the metal housing and connecting to multiple ground points, the conductive member equalizes ground potentials across different circuit boards, eliminating potential differences that would otherwise cause instability and performance degradation.

Inventive Principle:
Principle #12Equipotentiality

3Ease of operation

If a conductive support member is used to support circuit boards, then mechanical support is provided, but leakage current prevents direct ground connection

Engineering Contradiction:
Improvemechanical support functionVSAvoidground connection
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent replaces direct mechanical electrical contact (which causes leakage current) with capacitive coupling. The non-conductive layer between the conductive member and metal housing enables electrical connection through electric field coupling rather than physical contact. This substitution maintains the mechanical support function while eliminating leakage current issues associated with direct conductive contact.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a stable ground structure that enhances antenna performance and electrostatic tolerance by ensuring all circuit boards have the same ground potential, effectively addressing the issues of leakage currents and differing ground potentials.

Implementation Method 1

a capacitive coupling is formed between the conductive member and the metal bracket

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentUS11343914B2Electronic device including conductive member forming capacitive coupling with bracket and electrically connected to grounds of plurality of circuit boards disposed in the bracket
Publication Date: 2022.05.24 SAMSUNG ELECTRONICS CO LTD
  • US11343914B2 patent drawing
  • US11343914B2 patent drawing
  • US11343914B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a conductive support member, a first circuit board connected to the conductive support member by a first capacitor, a second circuit board connected to the conductive support member by a second capacitor, a first conductive connection member electrically connecting the first circuit board and the second circuit board, and a first ground structure, at least a portion of the first ground structure being interposed between the first conductive connection member and the conductive support member. The ground structure includes a non-conductive layer physically contacting the conductive support member, and a conductive layer electrically connected to the first conductive connection member to form a capacitive coupling with the conductive support member.