Integrated Capacitive Optical Sensor Package Structure
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Solution Overview
Problem
Current package structures and methods fail to efficiently integrate capacitive and optical sensors in a compact form, limiting the miniaturization and functionality of mobile devices and wearable electronics.
Innovation Solution
A package structure that includes a substrate with a sensing module featuring both capacitive and optical sensors, where the sensors share a pressing area and are enclosed within a package colloid, allowing for a single, integrated package that reduces volume and enhances integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitive and optical sensors are packaged separately, then each sensor can be optimized independently, but the overall device volume and complexity increase
Solution Approach 1:
The patent combines capacitive and optical sensors into a single integrated sensing module that shares common structures (substrate, pressing area, package colloid). This merging reduces overall package volume while maintaining the functional optimization of both sensor types through shared design elements.
Solution Approach 2:
The sensing module is designed with multi-functionality, where a single package structure supports both capacitive sensing and optical sensing functions. The package colloid and substrate serve universal roles for both sensor types, enabling space-efficient integration without compromising individual sensor performance.
2Volume of stationary object
If multiple sensors are integrated in one package, then device volume and cost are reduced, but manufacturing complexity increases
Solution Approach 1:
The integrated sensing module is segmented into distinct functional layers (substrate, sensing elements, package colloid) that can be manufactured and assembled separately before final integration. This segmentation approach simplifies the manufacturing process while achieving compact integration of multiple sensors.
3Volume of moving object
If sensors share a pressing area, then the device becomes more compact, but the structural design becomes more challenging
Solution Approach 1:
The pressing area is designed with local quality variations, where the package colloid and substrate provide different mechanical properties in different regions to accommodate both capacitive and optical sensing requirements. This localized design optimization enables compact integration while managing structural complexity through region-specific solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the simultaneous acquisition of fingerprint and health monitoring data, improving user experience by reducing device size and cost while maintaining high integration and functionality.
Implementation Method 1
at least one photo detection element located on the substrate and detect at least a portion of the detection light which is reflected off of an object making contact with the fingerprint sensor module
Implementation Method 2
The sensing module includes a capacitive sensor and an optical sensor
Data Source
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AI summary
A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.