Capacitive Touch Panel Layout With One Conductive Layer

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional capacitive touch panels have high manufacturing costs and increased thickness due to complex processes and the use of double-board structures with expensive transparent conductive substrates, which are difficult to recycle and result in material waste.

Innovation Solution

A capacitive touch panel design featuring a single conductive layer coated on a transparent substrate with a protection layer, reducing material waste and manufacturing complexity, and incorporating a flexible circuit board to simplify the structure and lower costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If double-board touch panel structure with multiple transparent conductive substrates is used, then touch control functionality is achieved, but manufacturing cost increases and thickness increases

Engineering Contradiction:
Improvetouch control functionalityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate transparent conductive substrates into a single integrated substrate structure. Instead of using multiple separate boards that require complex assembly, the invention integrates all conductive layers and functional elements onto one substrate, thereby simplifying the manufacturing process and reducing overall device complexity while maintaining touch control functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the touch panel into distinct functional layers (conductive layer, insulating layer, protective layer) on a single substrate. This segmentation allows each layer to be optimized independently for its specific function while avoiding the complexity of assembling multiple separate substrates. The layered structure enables simplified manufacturing compared to the double-board approach.

Inventive Principle:
Principle #1Segmentation

2Reliability

If multiple transparent conductive substrates with ITO coatings are used, then capacitive touch sensing is achieved, but manufacturing cost increases due to material waste and complex processes

Engineering Contradiction:
Improvecapacitive touch sensingVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple ITO-coated substrates into a single substrate with integrated conductive patterns. This eliminates the need for multiple expensive ITO coating processes and reduces material waste from defective products. By consolidating all capacitive sensing functionality into one substrate, the invention significantly reduces manufacturing costs while maintaining touch sensing capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a single-use substrate design where all conductive and insulating layers are integrated into one disposable unit. Instead of using multiple expensive substrates where defects require discarding entire assemblies, the invention allows for more economical manufacturing where a single defective layer can be addressed without wasting the entire multi-substrate assembly, thereby reducing overall manufacturing cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If double-board touch panel structure is used, then touch control functionality is achieved, but total thickness of electronic device increases

Engineering Contradiction:
Improvetouch control functionalityVSAvoidtotal thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent merges multiple thick substrates into a single thin substrate structure. By integrating all conductive layers, insulating layers, and protective elements onto one thin substrate, the invention dramatically reduces the total thickness of the touch panel while maintaining all necessary touch control functions. This merging approach eliminates the cumulative thickness of multiple separate boards.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes thin-film technology to create all conductive and insulating layers on the substrate. By employing thin-film deposition techniques for ITO coatings and other functional layers, the invention achieves the required electrical and mechanical properties while minimizing the thickness of each layer, thereby reducing the overall thickness of the touch panel to meet requirements for lightweight and slim electronic devices.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a reduction in manufacturing costs and overall thickness of electronic devices while maintaining touch control functionality, addressing the limitations of conventional touch panels.

Implementation Method 1

The capacitive touch panel can detect the capacitance change caused by the weak current of human body to identify the positions of the finger and touch selection conditions

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS8816233B2Capacitive touch panel unit
Publication Date: 2014.08.26 LIN CHIH CHUNG
  • US8816233B2 patent drawing
  • US8816233B2 patent drawing
  • US8816233B2 patent drawing

AI summary

A capacitive touch panel unit includes a transparent substrate, a conductive layer and a protection layer. The transparent substrate has a first side and a second side opposite to the first side. The conductive layer is disposed on the second side. The protection layer is correspondingly attached to one side of the conductive layer, which side is opposite to the transparent substrate. By means of the design of the capacitive touch panel unit, the number of the conductive layer is reduced to lower the manufacturing cost and reduce the total thickness.