Two-Sided Capacitive Sensor Layout for Lower-Cost Image Sensing
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Solution Overview
Problem
Capacitive image sensors in proximity sensor devices are costly and complex due to the need for multiple layers and intricate configurations, which hinders their performance and usability.
Innovation Solution
The development of capacitive image sensors that utilize only two layers of conductive elements formed on a single substrate, with specific arrangements of sensor electrodes and connectors to reduce complexity and cost, allowing for the integration of an integrated circuit between connectors and enabling efficient capacitive sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple layers and intricate configurations are used in capacitive image sensors, then measurement precision and sensing performance are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent transitions from traditional multi-layer vertical stacking to a planar two-dimensional arrangement where sensor electrodes and connectors are distributed on opposite sides of a single substrate. This dimensional reorganization maintains the necessary electrode connectivity while eliminating the need for complex multi-layer vertical interconnections, thereby reducing device complexity while preserving sensing performance.
Solution Approach 2:
The patent divides the sensor electrode structure into discrete segments (individual sensor electrodes and connectors) that are independently positioned on the substrate sides. This segmentation allows for simplified manufacturing and assembly while maintaining the functional integrity of the capacitive sensing array, resolving the contradiction between precision and complexity.
2Measurement precision
If multiple layers and intricate configurations are used in capacitive image sensors, then measurement precision and sensing performance are improved, but manufacturing cost increases
Solution Approach 1:
By reorganizing the sensor architecture from vertical multi-layer stacking to a planar two-sided configuration, the patent simplifies the manufacturing process. The sensor electrodes and connectors can be fabricated using standard planar deposition and patterning techniques on opposite sides of a single substrate, eliminating the need for complex multi-layer alignment and reducing manufacturing costs while maintaining sensing performance.
Solution Approach 2:
The patent extracts the connectivity function from the vertical interlayer structure and implements it through planar connectors on the substrate sides. This extraction simplifies the manufacturing process by eliminating the need for complex multi-layer via and interconnect fabrication, thereby reducing manufacturing cost while preserving the necessary electrical connections for high-precision sensing.
3Measurement precision
If sensor electrodes are arranged with small pitch for high resolution, then measurement precision is improved, but ease of manufacture deteriorates due to tighter spacing requirements
Solution Approach 1:
The patent resolves the spacing constraint by transitioning from a single-sided dense packing to a two-sided planar arrangement. Sensor electrodes and connectors are distributed on opposite sides of the substrate, effectively doubling the available fabrication space. This allows for smaller electrode pitch and higher spatial resolution while maintaining ease of manufacture through standard planar fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the cost and complexity of capacitive image sensors while maintaining performance by allowing for the formation of input devices with only conductive elements on two sides of the substrate, enhancing usability and efficiency.
Implementation Method 1
Each of the plurality of connectors ohmically couples two of the plurality of components along the second direction and through the first substrate to form the second array of second sensor electrodes
Implementation Method 2
proximity sensor device determines the presence, location and/or motion of one or more input objects
Data Source
AI summary
The embodiments described herein provide improved sensor devices and methods that facilitate improved sensor devices. Specifically, the devices and methods provide capacitive image sensors that require only two layers of conductive elements formed on a single substrate. The ability to provide an image sensor using only a single substrate with two layers of conductive elements may substantially reduce the cost and complexity of the capacitive image sensor. In one embodiment, an input device is provided that comprises a first substrate having a first and second side. Each of the second array of second sensor electrodes comprises a plurality of isolated components disposed on the first side and a plurality of connectors disposed on the second side. The connectors and isolated components of the second sensor electrodes are arranged such that adjacent pairs of connectors along the first direction are separated by a distance substantially greater than the first pitch.