Capacitive-Summing Junction Equalizer for Proximity Signal Integrity

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Solution Overview

Problem

Proximity communication systems face signal loss and delays due to long signal lines with appreciable resistance, capacitance, and inductance, which attenuate high-frequency signals and degrade data rates.

Innovation Solution

A semiconductor die with proximity connectors and a circuit that includes a filter with a capacitive-summing junction to equalize signals, using finite impulse response (FIR) or infinite impulse response (IIR) filters, and adjustable weights to reduce cross-talk and enhance bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If long signal lines are used to connect transmit/receive circuits to proximity pads, then the circuits can be positioned away from the pads, but signal loss and delays increase due to appreciable resistance, capacitance, and inductance

Engineering Contradiction:
Improvecircuit positioning flexibilityVSAvoidsignal loss
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent applies preliminary action by implementing equalization filters that pre-compensate for signal degradation before the signal traverses the long interconnect lines. The transmit equalizer adjusts the signal characteristics in advance to counteract the anticipated attenuation and distortion from the long signal lines, while the receive equalizer further compensates for remaining degradation after signal transmission.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If long signal lines are used, then circuit positioning flexibility improves, but data rates decrease due to dominant pole attenuation at high frequencies

Engineering Contradiction:
Improvecircuit positioning flexibilityVSAvoiddata rate
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent employs parameter changes by dynamically adjusting the equalization filter characteristics (such as pole-zero locations and gain values) to optimize signal transmission across varying frequency ranges. The equalizers modify their transfer function parameters to compensate for the frequency-dependent attenuation introduced by long interconnect lines, thereby maintaining high data rates despite the increased line length.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If multiple proximity connectors are used to reduce signal loss, then signal attenuation decreases, but cross-talk between signal paths increases

Engineering Contradiction:
Improvesignal attenuationVSAvoidcross-talk
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The patent uses equalization filters as intermediary processing elements that selectively enhance desired signal components while suppressing cross-talk interference. The filters act as mediators between the multiple proximity connectors and the receive circuits, applying differential weighting and phase adjustment to cancel out cross-talk signals while preserving the intended data transmission.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves communication by reducing signal loss, increasing data rates, and lowering power consumption, while maintaining a low bit error rate through uniform frequency response and reduced inter-symbol interference.

Implementation Method 1

communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentUS8735184B2Equalization in proximity communication
Publication Date: 2014.05.27 ORACLE INT CORP
  • US8735184B2 patent drawing
  • US8735184B2 patent drawing
  • US8735184B2 patent drawing

AI summary

A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.