Capacitive Thermal Material Reservoirs for IC Hotspot Management
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Solution Overview
Problem
High-end integrated circuits with stacked chip configurations face challenges in heat dissipation due to localized thermal hotspots, which conventional cooling solutions, such as heat sinks and heat spreaders, struggle to address effectively, especially in small form factor devices like smartphones.
Innovation Solution
The integration of capacitive thermal material, either internally or externally within the IC package, which absorbs and stores heat through phase change materials, allowing for efficient heat management by transitioning between solid and liquid states to manage thermal energy, thereby reducing hotspot temperatures without increasing device size or thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling solutions (heat sinks, heat spreaders) are increased in size to dissipate heat from hotspots, then heat dissipation capability is improved, but device form factor increases
Solution Approach 1:
The patent applies phase change materials (PCM) that transition between solid and liquid states to absorb and store thermal energy. The capacitive thermal material reservoirs contain PCM that melts to absorb heat from hotspots and solidifies to release heat, providing dynamic thermal management without requiring large heat sinks or spreaders. This phase transition mechanism enables effective heat dissipation in a compact form factor.
Solution Approach 2:
The patent changes the thermal capacity parameter by introducing capacitive thermal material reservoirs with high heat storage capacity. These reservoirs are positioned laterally relative to heat-generating devices and connected via thermal pathways, enabling them to absorb and store thermal energy dynamically. This parameter change allows the system to manage heat effectively without increasing device volume.
2Temperature
If heat spreader size is increased to improve heat dissipation, then thermal management is improved, but device thickness increases
Solution Approach 1:
The patent transitions from two-dimensional heat spreading (requiring large heat spreaders) to three-dimensional heat storage by introducing capacitive thermal material reservoirs positioned laterally and connected through thermal pathways. This dimensional change allows heat to be absorbed and stored in volumetric reservoirs rather than requiring extended surface area, thereby reducing device thickness while improving thermal management.
Solution Approach 2:
The patent embeds capacitive thermal material reservoirs within the device structure, nesting them laterally relative to heat-generating devices and connecting them through thermal pathways. This nested configuration allows the thermal management system to be integrated within the existing device footprint without adding significant thickness, as the reservoirs are positioned and connected in a space-efficient manner.
3Temperature
If conventional heat dissipation methods are used in stacked chip configurations, then heat is dissipated, but localized thermal hot spots are created that reduce cooling effectiveness
Solution Approach 1:
The patent introduces thermal pathways as intermediaries that connect heat-generating devices to capacitive thermal material reservoirs. These pathways efficiently transfer heat from localized hotspots to the larger thermal mass of the reservoirs, distributing the thermal load and preventing concentration of heat in small areas. This intermediary mechanism improves cooling effectiveness by bridging the gap between localized heat sources and distributed thermal storage.
Solution Approach 2:
The patent applies capacitive thermal material reservoirs with high thermal capacity at specific locations laterally relative to heat-generating devices, creating localized zones of enhanced heat absorption. The thermal pathways are strategically positioned to channel heat from hotspots to these localized reservoirs, providing targeted thermal management that addresses localized hot spots while maintaining overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates heat from hotspots within the IC package, maintaining low junction temperatures and extending thermal storage capabilities in compact devices without enlarging their form factor, thus enhancing thermal package management in 3D stacked ICs.
Implementation Method 1
absorbing and stores heat through phase change materials, allowing for efficient heat management by transitioning between solid and liquid states
Implementation Method 2
absorbs and stores heat through phase change materials
Implementation Method 3
a heat spreader having a first side that is attached to the IC package
Data Source
AI summary
An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.