Single Layer Capacitive Touch Backlight Module Soft Board Routing
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Solution Overview
Problem
Existing single layer capacitive touch modules face challenges with wide lead-in and lead-out areas on soft boards, leading to space crowding and limited flexibility due to the need for extensive wiring and the use of double layer soft boards, which are difficult to bend.
Innovation Solution
A single layer capacitive touch module design featuring a sensor dot matrix with M×N sensor dots, a driving unit, a first soft board with a bridge connection layout, and a second soft board with reduced lead number, allowing direct connections and folding capabilities to minimize space and enhance flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single layer soft board is used with individual wiring for each sensor dot, then the wiring complexity is reduced, but the lead number increases causing wide lead-in and lead-out areas
Solution Approach 1:
The patent divides the soft board into two separate layers: a first soft board for driving lines and a second soft board for sensing lines. This segmentation allows independent routing of driving and sensing signals, reducing the need for extensive cross-wiring and thereby reducing the lead area width while maintaining wiring simplicity.
Solution Approach 2:
The patent transitions from a single-layer planar wiring approach to a multi-layer three-dimensional structure. By stacking the first and second soft boards vertically, the wiring is distributed across multiple dimensions, reducing the crowding of leads in any single plane and effectively reducing the lead area width.
2Quantity of substance
If a double layer soft board is used to bridge connect driving lines, then the lead number is reduced, but the width and thickness increase making it hard to bend
Solution Approach 1:
Instead of using a single thick double-layer soft board, the patent segments the structure into two separate thin soft boards stacked vertically. Each soft board handles specific signal types (driving or sensing), which reduces the thickness of each individual board while maintaining the lead reduction benefit, thereby preserving bending flexibility.
Solution Approach 2:
The patent employs thin soft board structures for both the first and second layers, ensuring that each board remains flexible and easy to bend. This approach maintains the lead number reduction advantage while avoiding the rigidity issue associated with thick double-layer boards.
3Reliability
If the lead-out area is made wide to accommodate all leads, then all sensor dots can be connected, but space crowding occurs on the soft board
Solution Approach 1:
The patent segments the lead connections into two separate groups: driving line leads on the first soft board and sensing line leads on the second soft board. This segmentation allows the lead-out area to be divided into two smaller, more manageable regions, ensuring all sensor dots are connected while reducing space crowding.
Solution Approach 2:
By distributing leads across two vertical layers, the patent effectively utilizes three-dimensional space. The lead-out areas of the two soft boards can be positioned at different horizontal locations, reducing spatial overlap and crowding while maintaining complete connectivity to all sensor dots.
Data Source
AI summary
A single layer capacitive touch module including a sensor dot matrix is provided. The sensor dot matrix has M×N sensor dots formed by M driving lines intersecting N sensing lines. Each one of the sensing lines and M driving lines forming a sensor zone, wherein each sensor zone comprises M sensor dots, M and N are positive integers. A driving unit is coupled to the driving lines. A first soft board has a lead-in area on a first side thereof to be coupled with the driving lines on a first side of the sensor dot matrix. A second soft board has a lead-in area on a first side for being coupled with the driving lines and sensing lines on a second side of the sensor dot matrix opposite the first side of the sensor dot matrix.