Capacitive Touch Panel Bridge Structure for Light Transmission
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Solution Overview
Problem
Conventional capacitive touch panels face challenges with low light transmission and complex fabrication processes due to their multilayer stacking structure, making them difficult to integrate into thin and lightweight electronic devices.
Innovation Solution
A method of fabricating a capacitive touch panel involving a substrate with bridge components, curved insulation mounds, and interlaced conductive patterns, which reduces the number of layers and improves light transmittance by forming a novel bridge structure and using a curved insulation mound to prevent contact issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a multilayer stacking structure is used in conventional capacitive touch panels, then the touch detection function is achieved, but the light transmission ratio decreases and the panel volume and weight increase
Solution Approach 1:
The patent merges the sensing electrodes and connection components into a single conductive layer on the substrate, eliminating the need for separate transparent conductive films and alignment layers. This consolidation reduces the number of layers from five or more to essentially one functional layer, thereby improving light transmission and reducing panel thickness and weight while maintaining touch detection capability.
Solution Approach 2:
The patent transitions from a traditional multilayer stacking architecture (vertical dimension) to a planar integrated architecture where sensing electrodes and connections coexist in the same layer (horizontal dimension). This dimensional reorganization eliminates the need for multiple stacked transparent films, directly addressing the light transmission and complexity issues.
2Measurement precision
If sensing conductive films are located on both sides of a transparent substrate, then touch sensitivity is improved, but the fabrication process becomes more cumbersome and difficult to upgrade
Solution Approach 1:
The patent combines the sensing electrode function and connection function into a single integrated conductive pattern on one side of the substrate. This merger simplifies the fabrication process to a single patterning and deposition step, eliminating the complex alignment and bonding processes required for dual-sided films, while the interlaced pattern design maintains sensitivity through increased electrode density.
Solution Approach 2:
The patent segments the touch panel into distinct functional zones: sensing electrode regions for touch detection and connection component regions for signal routing. This segmentation allows each zone to be optimized independently and simplifies the overall fabrication by allowing simultaneous formation of both functions in a single process layer.
Data Source
AI summary
The disclosure relates to a method of fabricating a capacitive touch pane where a plurality of groups of first conductive patterns are formed along a first direction, a plurality of groups of second conductive patterns are formed along a second direction, and a plurality of connection components are formed on a substrate. Each of the first conductive patterns is electrically connected to another adjacent first conductive pattern in the same group by each of the connection components and each of the plurality of groups of the second conductive patterns is interlaced with and insulated from each of the plurality of groups of the first conductive patterns. A plurality of curved insulation mounds are formed to cover the first connection components. A plurality of bridge components are formed to electrically connect each of the second conductive patterns with another adjacent second conductive pattern in the same group.