Capacitive Touch Panel Conductor Pattern Structure
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Solution Overview
Problem
Conventional capacitive touch panels are thick due to the need for two capacitive sensing layers separated by insulation, complicating manufacturing and hindering miniaturization.
Innovation Solution
A capacitive touch panel with a thin conductor pattern structure featuring first-axis and second-axis conductor assemblies on the same substrate surface, interconnected by conduction lines isolated by an insulation layer, allowing capacitive effects between adjacent cells when touched.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two capacitive sensing layers are separated by insulation material, then capacitive sensing function is achieved, but panel thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent merges two separate capacitive sensing layers into a single integrated structure where first and second conductor assemblies are formed on the same substrate surface. The insulation layer is positioned only between adjacent conductor assemblies rather than separating entire layers, thereby achieving capacitive sensing functionality while reducing overall panel thickness.
Solution Approach 2:
The patent transitions from a three-layer stacked architecture (two sensing layers separated by insulation) to a planar two-dimensional arrangement where conductor assemblies are distributed on the same surface. This dimensional reorganization eliminates the need for thick inter-layer insulation while preserving capacitive sensing through lateral isolation of conductors.
2Reliability
If two capacitive sensing layers are separated by insulation material, then capacitive sensing function is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple conductor assemblies and insulation structures into a single integrated manufacturing process. All conductor assemblies are formed on the same substrate surface in one process sequence, eliminating the need for separate layer deposition and alignment steps required for multi-layer capacitive structures.
Solution Approach 2:
The patent segments the conductor pattern into multiple independent assemblies (first and second conductor assemblies with respective conductor cells) that can be manufactured using identical processes. This modular segmentation allows standardized fabrication techniques to be applied uniformly across the entire structure, simplifying manufacturing compared to custom multi-layer approaches.
3Length of stationary object
If conductor assemblies are arranged on the same substrate surface, then panel thickness is reduced and manufacturing is simplified, but insulation between adjacent conductors must be maintained
Solution Approach 1:
The patent applies insulation selectively only where needed—specifically between adjacent first and second conductor assemblies—rather than creating a continuous insulation barrier throughout the structure. This localized insulation approach maintains the thin-profile advantage while providing necessary electrical isolation at critical interfaces.
Solution Approach 2:
The patent introduces an insulation layer as an intermediary element positioned between adjacent conductor assemblies. This intermediary provides the necessary electrical isolation to prevent signal interference while maintaining a compact, thin overall structure that allows all conductors to reside on the same substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the structure, reduces thickness, and facilitates cost-effective manufacturing while maintaining accurate touch position detection.
Implementation Method 1
the first-axis conductor assemblies and the second-axis conductor assemblies that are touched by the user induce capacitive effect between adjacent conductor cells thereof
Data Source
AI summary
Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.