Capacitive Touch Panel Structure Without Lens or Optical Adhesive

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Solution Overview

Problem

Conventional capacitance touch panel modules are overly thick, resulting in suboptimal light transmittance and reduced quality, and rely on expensive, non-recyclable optical adhesives.

Innovation Solution

A method of fabricating a capacitance touch panel module that eliminates the need for a protective lens by forming a substrate with conductive patterns and insulated protrusions, using lithography or photo etching to create a structure that enhances light transmittance without requiring optical adhesives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a protective lens and optical adhesive are used in conventional capacitance touch panel modules, then the structural integrity and bonding are improved, but the overall thickness increases and light transmittance decreases

Engineering Contradiction:

Improvestructural integrityVSAvoidoverall thickness

Core Design Contradiction:

StrengthVSLength of stationary object

Solution Approach 1:

The patent removes the protective lens and optical adhesive from the conventional touch panel structure. The substrate itself is designed with a recessed region that directly receives the conductive layer, eliminating the need for separate protective lens and adhesive components, thereby reducing thickness while maintaining structural integrity

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the protective lens function and bonding function into the substrate structure itself. The recessed region of the substrate serves both as a protective element and as a bonding interface for the conductive layer, eliminating the need for separate protective lens and optical adhesive layers

Inventive Principle:

Principle #5Merging (Combining)

2Strength

If a protective lens and optical adhesive are used in conventional capacitance touch panel modules, then the structural integrity is improved, but light transmittance deteriorates

Engineering Contradiction:

Improvestructural integrityVSAvoidlight transmittance

Core Design Contradiction:

StrengthVSIllumination intensity

Solution Approach 1:

The patent removes the protective lens and optical adhesive components that block light. By eliminating these layers, the substrate provides direct optical transmission paths while maintaining structural integrity through its recessed design that bonds the conductive layer

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate structure is merged to perform both protective and optical transmission functions. The recessed region provides structural bonding while the exposed surface maintains high light transmittance without requiring separate protective lens and adhesive layers

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If optical adhesive is used in conventional capacitance touch panel modules, then the bonding between components is improved, but manufacturing cost increases and environmental friendliness deteriorates

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent eliminates the optical adhesive component from the assembly process. The substrate's recessed region provides mechanical bonding through direct contact and adhesion to the conductive layer, removing the need for expensive and non-recyclable optical adhesive materials

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces expensive optical adhesive with a simpler, more cost-effective bonding approach using the substrate's own structure. The recessed region provides sufficient bonding strength without requiring additional adhesive materials, reducing both material cost and environmental impact

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a thinner, higher transmittance capacitance touch panel module that reduces material costs and environmental impact by eliminating the need for optical adhesives, while maintaining multi-touch capabilities and dustproof properties.

Implementation Method 1

A transparent conductive layer is formed on the substrate

Methodology Applied

Scientific EffectDeposition (physical): Deposition (physical)

Implementation Method 2

a photoresist layer (not shown) or similar types of photosensitive insulating layer is formed on the substrate 301 and undergoes lithography to form a plurality of insulated protrusions 313

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 3

a metallic layer (not shown) is deposited on the substrate 301

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS8729910B2Capacitance touch panel module and fabrication method thereof

Publication Date: 2014.05.20 INNOCOM TECH (SHENZHEN) CO LTD

AI summary

The invention discloses a method of fabricating a capacitance touch panel module. The method includes providing a substrate with a touching area and a peripheral area; forming a plurality of first conductive patterns on the substrate along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covers one connecting portion; forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.