Capacitive Inspection Apparatus for TSV Disconnection Detection
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Solution Overview
Problem
Existing inspection methods for wiring substrates, particularly those with Through Silicon Via (TSV) technology, face challenges in detecting disconnections due to small electric capacitance between the TSV and electrodes, making it difficult to accurately inspect for disconnections in thin silicon or glass substrates with small conductive materials.
Innovation Solution
An inspection apparatus and method that increases the apparent electric capacitance by using a substrate with insulating material and electrodes arranged in a specific configuration, allowing for easier detection of disconnections by measuring electric capacitance between the wiring and electrodes, even in cases where the capacitance is small.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the electric capacitance measurement method is used to inspect wiring substrates with TSV technology, then the inspection can be performed, but the small electric capacitance between the TSV and electrodes makes it difficult to detect disconnections accurately
Solution Approach 1:
The patent merges multiple electrodes (first electrode and second electrode) into a single measurement system. The first electrode is positioned close to the wiring and the second electrode is positioned at a distance, creating a combined capacitive measurement system that amplifies the detectable capacitance signal, thereby improving disconnection detection accuracy despite the inherently small capacitance of TSV structures
Solution Approach 2:
The patent introduces an intermediary measurement approach by using a capacitive coupling system between two electrodes rather than direct electrical contact. This intermediary capacitive measurement method allows detection of disconnections without requiring large capacitance values, as the measurement is based on changes in the electric field distribution caused by disconnections
2Reliability
If the continuity check method is used to inspect wiring substrates, then disconnections can be detected, but the inspection process becomes very complicated when multiple independent wiring patterns are present
Solution Approach 1:
The patent creates a universal inspection system that can handle multiple independent wiring patterns simultaneously using the same capacitive measurement approach. Instead of requiring different inspection methods for different wiring configurations, the capacitive measurement system with first and second electrodes provides a unified solution that works for all wiring patterns, thereby reducing inspection process complexity while maintaining reliable disconnection detection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate detection of disconnections in wiring substrates with small electric capacitance, improving inspection efficiency and reliability for TSV technology and similar applications.
Implementation Method 1
measuring an electric capacitance between a wiring and an electrode such as a ground (GND) and comparing a magnitude of the obtained electric capacitance with an expected value
Data Source
AI summary
An inspection apparatus for inspecting an inspection object. The inspection object includes a base body and wiring passing through the base body. The inspection apparatus includes an insulating substrate, a first electrode in the substrate with a portion of the first electrode exposed from a surface of the substrate to form a connection portion which may be electrically connected with the wiring, and a second electrode in the substrate. The first electrode and the second electrode are spaced apart, have mutually parallel portions, and are electrically insulated from each other.