Integrated Capacitive Voltage Sensor Structure Without Extra Assembly
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Solution Overview
Problem
Current methods for forming capacitive voltage sensors are laborious, require multiple components, and are expensive due to the need for component preparation and assembly.
Innovation Solution
A method involving a conductive body with layers of insulating and semiconductive materials, where a disconnected portion of semiconductive material is created to form a capacitive coupling, allowing for the detection of electrical voltage without interrupting the structural or conductive continuity, thus eliminating the need for additional components and complex assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple components are prepared and assembled to form a capacitive voltage sensor, then the sensor can be constructed with distinct functional layers, but the manufacturing process becomes laborious and expensive
Solution Approach 1:
The patent combines multiple separate components (conductive body, insulating layer, semiconductive layer) into a single integrated structure where layers are formed sequentially on the same substrate. This merging eliminates the need for separate component preparation and assembly operations, reducing manufacturing complexity while maintaining functional integrity.
Solution Approach 2:
The conductor device structure serves multiple functions simultaneously: the conductive body provides electrical conduction, the insulating layer provides electrical insulation, and the semiconductive layer with disconnected portion provides both structural continuity and capacitive sensing functionality. This multi-functionality reduces the need for additional specialized components.
2Reliability
If additional components are used to create the capacitive sensor structure, then the sensor functionality is achieved, but the production cost increases
Solution Approach 1:
The patent merges the functions of multiple components into a single integrated device structure. The conductor device itself becomes the capacitive sensor by forming the semiconductive layer with a disconnected portion directly on its surface, eliminating the need for separate capacitive sensing components and reducing overall component quantity.
Solution Approach 2:
The conductor device is designed to perform multiple functions: electrical conduction through the conductive body, electrical insulation through the insulating layer, and capacitive voltage sensing through the semiconductive layer with disconnected portion. This multi-functionality reduces the total number of components needed while achieving full sensor functionality.
3Manufacturing precision
If complex assembly operations are performed to form the capacitive sensor, then the required structural precision is achieved, but the manufacturing time and labor increase
Solution Approach 1:
The patent segments the sensor formation into sequential depositive steps (forming insulating layer, then semiconductive layer) rather than complex assembly operations. The disconnected portion is created by selective removal or non-deposition in a specific region, which is simpler than assembling multiple precision components together.
Solution Approach 2:
The insulating and semiconductive layers are formed in advance as integral parts of the conductor device structure during manufacturing, rather than being assembled later. The disconnected portion is prepared during the layer formation process itself, eliminating subsequent complex assembly operations and improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the quick and cost-effective production of capacitive voltage sensors by maintaining structural and electrical continuity, allowing for efficient detection of electrical voltage without laborious operations or additional components.
Implementation Method 1
a capacitive coupling is formed between the live conductor (first armature of the coupling) and said first disconnected portion (second armature of the coupling)
Data Source
Figure 1~4
AI summary
_A method to obtain a capacitive voltage sensor by a conductor device (100) of electrical current, in which said conductor device (100) comprises a conductor (110) a layer (120) of insulating material a layer (130) of semiconductive material, in which a first disconnected portion (131) of layer of semiconductive material is formed a by means of said layer of semiconductive material (130); in which said first disconnected portion (131) of the semiconductive material is kept on the said layer of insulating material (120); in which said disconnected portion (131) of the semiconductive material layer is electrically disconnected with respect to the remaining layer (132) of semiconductive material; and in which said first disconnected portion (131) of the semiconductive material is electrically isulated with respect to the remaining layer (132) of semiconductive material. _A capacitive voltage sensor.