Non-Contact Wiring Short Detection via Capacitive Coupling
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Solution Overview
Problem
Existing methods for detecting wiring shorts in substrates, particularly those with high resistance values, are inefficient due to the difficulty in contacting finer wirings, leading to potential scratches and reduced detection accuracy.
Innovation Solution
An apparatus and method utilizing capacitively coupled electrodes and a sensing circuit to apply a measurement voltage and determine short circuit connections based on the change rate of output voltage, allowing for non-contact detection of wiring shorts with varying resistance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a contact method is used to bring a measuring device into contact with a wiring, then detection can be performed, but it becomes difficult to contact finer wirings and secondary failures occur from scratches
Solution Approach 1:
The patent replaces the mechanical contact-based measurement system with a non-contact electromagnetic field-based measurement system. The measuring device uses electromagnetic induction to detect wiring shorts without physical contact, thereby eliminating scratches and secondary failures while maintaining detection capability for finer wirings
Solution Approach 2:
The patent introduces an electromagnetic field as an intermediary between the measuring device and the wiring. Instead of direct mechanical contact, the measurement is performed through electromagnetic coupling, allowing detection without physical touch and preventing damage to the wiring
2Volume of moving object
If substrates are thinned and wiring becomes finer, then substrate integration is improved, but contact detection becomes difficult and secondary failures increase
Solution Approach 1:
The patent replaces mechanical contact detection with electromagnetic field-based non-contact detection. This allows measurement of thinned substrates with finer wirings without the difficulty of physical contact, as the electromagnetic field can penetrate and interact with the wiring structure without requiring direct access
3Measurement precision
If detection accuracy is improved for high resistance value shorts, then more shorts are detectable, but contact method limitations prevent this
Solution Approach 1:
The patent replaces the contact-based measurement system with a non-contact electromagnetic measurement system that can detect high resistance value shorts more effectively. The electromagnetic induction method provides better sensitivity for high resistance detections without being constrained by physical contact limitations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate detection of wiring shorts with high resistance values, improving detection accuracy and reducing the risk of secondary failures associated with contact-based methods.
Implementation Method 1
a plurality of electrodes including a first electrode element capacitively coupled to the first wiring and a second electrode element capacitively coupled to a second wiring of the substrate
Data Source
AI summary
An apparatus for detecting a wiring short in a substrate includes a voltage source configured to apply a rising or falling measurement voltage to a first wiring of a substrate, a plurality of electrodes including first and second electrode elements capacitively coupled to the first and second wirings of the substrate, respectively, a sensing circuit configured to generate an output voltage based on a voltage or a current between the first and second electrode elements, and a processor configured to determine whether a short circuit connection having a resistance value greater than a reference resistance value is present between the first and second wirings based on a change rate of the output voltage after application of the measurement voltage. Methods for detecting wiring shorts in the substrate are further provided.