Capacitor Electrode Adhesive Layer to Prevent Dielectric Peeling
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Solution Overview
Problem
The existing electronic components with a capacitor configuration are prone to peeling at the interface between the conductor layer and the dielectric film, particularly when an inductor pattern is formed using multiple conductor layers, which compromises the reliability of the component.
Innovation Solution
Incorporating an adhesive film between the dielectric film and the top and side surfaces of the lower electrode, along with a laminated structure of a seed layer and plating layer for the upper electrode, to enhance adhesion and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric film directly covers the top and side surfaces of the capacitor lower electrode, then the capacitor structure is simple and manufacturing is easier, but peeling occurs at the interface between the dielectric film and the lower electrode, reducing reliability
Solution Approach 1:
An adhesive film is introduced as an intermediary layer between the lower electrode and the dielectric film. This adhesive film specifically addresses the adhesion problem at the interface by providing a material that bonds effectively to both the electrode and the dielectric film, preventing peeling while maintaining the overall capacitor structure.
Solution Approach 2:
The capacitor structure employs composite materials by combining the adhesive film with the existing lower electrode and dielectric film. This multi-material approach leverages the specific properties of each material: the conductivity of the electrode, the adhesive properties of the adhesive film, and the insulating properties of the dielectric film, creating a more reliable layered structure.
2Object-affected harmful factors
If insulating layers cover multiple conductor layers to provide electrical isolation, then electrical insulation is improved, but stress accumulates at the interfaces causing peeling between the dielectric film and the lower electrode
Solution Approach 1:
The adhesive film serves as a stress-absorbing intermediary layer between the lower electrode and the dielectric film. This layer can accommodate the stress generated by the insulating layers covering multiple conductor layers, preventing the stress from causing peeling at the critical interface while maintaining effective electrical insulation.
Solution Approach 2:
The adhesive film is positioned beforehand at the interface where stress concentration is most likely to occur. This proactive placement provides cushioning against the stress that will be generated when insulating layers are added to achieve electrical isolation, preventing peeling before it can occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the likelihood of peeling at the interface, thereby enhancing the reliability and stability of the electronic component.
Implementation Method 1
a first adhesive film interposed between the dielectric film and the top and side surfaces of the lower electrode
Data Source
AI summary
An electronic component has: a conductor layer M1 formed on a substrate and including lower electrodes of a capacitor; a dielectric film covering the top and side surfaces of each of the lower electrodes; upper electrodes of the capacitor which are formed on the top surfaces of the respective lower electrodes through the dielectric film; and an adhesive film disposed between the dielectric film and the top and side surfaces of each of the lower electrodes. The adhesive film is thus disposed between the dielectric film and the top and side surfaces of each of the lower electrodes.