Multilayer Capacitor Adhesive Layer Thickness Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer capacitors in electronic devices generate acoustic noise due to vibrations caused by piezoelectric effects, and existing solutions using interposers face challenges in securing sufficient fixing strength as they decrease in size, leading to potential separation during board mounting.
Innovation Solution
An electronic component design that includes a multilayer capacitor with an adhesive layer between the capacitor and interposer, where the adhesive layer's height is optimized to secure fixing strength while reducing acoustic noise, using a ratio of 0.1≤t/T≤0.3, with t being the adhesive layer's maximum height and T the component's height, and featuring an epoxy resin adhesive and alumina interposer for effective bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is used to reduce acoustic noise, then acoustic noise is reduced, but bonding area is reduced causing insufficient fixing strength
Solution Approach 1:
The patent optimizes the thickness parameter of the adhesive layer (t/T ratio where t is adhesive layer thickness and T is total component height) to satisfy 0.05 ≤ t/T ≤ 0.30. This parameter optimization simultaneously achieves sufficient bonding strength and acoustic noise reduction without requiring larger bonding area
Solution Approach 2:
The patent uses composite material structure combining specific adhesive materials (epoxy resin with fillers such as alumina, silica, or titanium oxide) to enhance both bonding strength and noise damping properties. The composite adhesive layer provides mechanical strength for bonding while the filler materials contribute to acoustic noise reduction
2Strength
If adhesive layer thickness is increased to improve bonding strength, then fixing strength is improved, but acoustic noise reduction effect deteriorates
Solution Approach 1:
The patent establishes an optimal range for adhesive layer thickness relative to total component height (t/T ratio between 0.05 and 0.30). Within this range, the adhesive layer is thick enough to provide sufficient bonding strength but thin enough to maintain effective acoustic noise reduction. This parameter optimization resolves the trade-off between strength and noise reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively secures fixing strength and reduces acoustic noise by optimizing the adhesive layer's size, ensuring the multilayer capacitor and interposer remain bonded during board mounting and operation, with specific dimensions for different capacitor lengths optimizing both fixing strength and noise reduction.
Implementation Method 1
an adhesive layer disposed on facing boundaries of the multilayer capacitor and the interposer
Implementation Method 2
the dielectric layers have piezoelectric properties. Accordingly, when a direct current (DC) voltage or an alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes. As a result, the volume of a ceramic body is expanded and contracted depending on a frequency, to cause periodic vibrations
Data Source
AI summary
An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive layer disposed on facing boundaries of the multilayer capacitor and the interposer; wherein the external terminals include bonding portions disposed on a top surface of the interposer body and connected to the external electrodes via the adhesive layer, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer body to connect the bonding portions and the mounting portions to each other; wherein 0.1≤t/T≤0.3 in which dimension “t” is a maximum height of the adhesive layer and dimension “T” is a height of the electronic component.