Deep Trench Capacitor Alignment Using Pedestal and Dielectric Gap Fill
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Solution Overview
Problem
The thickness mismatch between deep trench capacitors and substrate cores in integrated circuit packages leads to misalignment and alignment challenges during semiconductor device placement, causing mechanical stress and processing issues.
Innovation Solution
A pedestal or spacer is used to support and align the deep trench capacitor within the substrate core, with dielectric materials filling gaps to secure the capacitor in place, allowing for precise alignment and subsequent removal of the spacer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If deep trench capacitors are placed directly in substrate cores, then manufacturing process is simple, but misalignment occurs due to thickness mismatch
Solution Approach 1:
A spacer element is introduced as an intermediary component between the deep trench capacitor and the substrate core. The spacer compensates for thickness mismatches and enables precise alignment during placement, resolving the contradiction between simple manufacturing and high precision alignment requirements.
Solution Approach 2:
The spacer is pre-positioned in the substrate core before the deep trench capacitor is placed. This preliminary action establishes the correct alignment position, allowing the capacitor to be accurately positioned without requiring complex alignment procedures during the actual placement process.
2Manufacturing precision
If spacers are used to align deep trench capacitors, then alignment precision improves, but device complexity increases
Solution Approach 1:
The alignment function is segmented into a separate spacer component rather than being integrated into the substrate core or capacitor structure. This modular approach achieves high alignment precision while keeping each component relatively simple in design and fabrication.
3Stability of the object's composition
If dielectric materials are used to fill gaps, then mechanical stability improves, but manufacturing complexity increases
Solution Approach 1:
The dielectric gap-filling operation is merged with the existing encapsulation process. The same dielectric material used for encapsulation is also used to fill gaps, combining two functions into one manufacturing step and achieving mechanical stability without significantly increasing process complexity.
Data Source
AI summary
An apparatus includes a package substrate comprising a core having a first surface along a first plane and a second surface along a second plane, a semiconductor device disposed within an opening in the core, the semiconductor device having a third surface along a third plane and a fourth surface along a fourth plane, the third plane substantially parallel to the first plane, a first dielectric material disposed on the first surface of the core, the first dielectric material extends into the opening to fill a first gap between a wall of the opening and a lateral surface of the semiconductor device, and a second dielectric material disposed on the second surface of the core, the second dielectric material extends into the opening to fill a second gap between the second plane and the fourth plane.