Capacitor Array Vibration Isolation for Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer electronic components, such as capacitors, generate acoustic noise and high-frequency vibrations that can be perceived as malfunctions in quiet environments and interfere with voice outputs and sensor operations, especially in IT and automotive industries.
Innovation Solution
The design incorporates a capacitor array with multilayer capacitors and bump terminals made of metal or insulating material with conductor patterns, featuring cut-out portions that act as solder pockets to reduce vibrations and noise by spacing the capacitors and allowing for elastic deformation, thereby absorbing and reducing piezoelectric vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multilayer capacitors are used as dielectric materials with piezoelectricity, then electrical functionality is achieved, but acoustic noise and high-frequency vibrations are generated
Solution Approach 1:
The capacitor array is divided into multiple individual multilayer capacitors arranged in a specific pattern, with each capacitor being independently mounted on the substrate. This segmentation allows for controlled vibration isolation between individual capacitor units, reducing the transmission of piezoelectric vibrations to the substrate while maintaining the required electrical capacitance functionality.
Solution Approach 2:
A vibration isolation structure is introduced as an intermediary element between the multilayer capacitors and the substrate. This intermediary layer absorbs and dampens the piezoelectric vibrations generated by the capacitors, preventing direct transmission to the substrate and reducing acoustic noise while allowing the capacitors to maintain their electrical function.
2Volume of moving object
If capacitors are mounted closely together for compact design, then device size is reduced, but vibration transmission to substrate increases
Solution Approach 1:
The vibration isolation structures are selectively applied at specific locations beneath each capacitor or at critical vibration transmission points, rather than uniformly across the entire substrate. This localized approach provides effective vibration damping in key areas while maintaining compact overall device dimensions and allowing close capacitor spacing where needed.
Solution Approach 2:
The vibration isolation structure utilizes composite material properties, combining materials with different damping characteristics to create an effective vibration isolation layer. This composite approach enables compact design by providing high vibration attenuation in a thin profile, allowing capacitors to be mounted closely together without excessive vibration transmission.
3Reliability
If rigid mounting structure is used for stable electrical connection, then electrical reliability is improved, but acoustic noise is amplified
Solution Approach 1:
The vibration isolation structure serves as a mediator between the rigid electrical connection requirements and acoustic noise reduction. It provides a compliant interface that allows stable electrical connectivity while decoupling the mechanical vibration transmission path, thereby reducing acoustic noise without compromising electrical reliability.
Solution Approach 2:
The vibration isolation structure employs flexible thin film or layer materials that can accommodate thermal expansion and mechanical stress while maintaining electrical connections. These flexible structures dampen vibrations and reduce acoustic noise while preserving stable electrical connectivity between components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes acoustic noise and high-frequency vibrations, preventing sensor malfunctions and allowing for a more compact, easily mountable electronic component with maintained electrical properties.
Implementation Method 1
As a dielectric material has piezoelectricity, a dielectric material may be synchronized with an applied voltage and may be deformed
Implementation Method 2
a vibration isolation structure may be disposed between the capacitor array and the substrate... effectively minimizes acoustic noise and high-frequency vibrations
Data Source
AI summary
An electronic component includes a capacitor array in which a plurality of multilayer capacitors are disposed in a row in a first direction connecting fifth and sixth surfaces, each of the plurality of multilayer capacitors including a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and first and second external electrodes respectively including first and second connection portions and first and second band portions, respectively; a first bump terminal connected to the first band portions of the plurality of first external electrodes on a first surface of the capacitor array; and a second bump terminal spaced apart from the first bump terminal and connected to the second band portions of the plurality of second external electrodes on the first surface of the capacitor array.