Capacitor Assembly Package Structure Reducing Stacking Gap Pores
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Solution Overview
Problem
Existing capacitor assembly structures suffer from high structural defect rates due to pores formed in stacking gaps, which affect structural stability and can lead to electrical characteristic degradation and structural cracks during the reflow process.
Innovation Solution
A capacitor assembly package structure is designed with a capacitor assembly, first insulating package bodies, a second insulating package body, and an electrode assembly. The first insulating package bodies are configured to fill the stacking gaps, while the second insulating package body covers them, with a solid content and volume ratio optimized to reduce pore formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If capacitor structures are stacked together to form a stacked solid electrolytic capacitor, then the electrical capacity is increased, but pores are formed in the stacking gaps causing structural defects
Solution Approach 1:
An insulating package body is introduced as an intermediary material to fill the stacking gaps between capacitor structures. This mediator eliminates pores while maintaining electrical isolation, thus increasing electrical capacity without introducing structural defects.
Solution Approach 2:
The solid content of the insulating package body is optimized to be between 60-80%, creating a balance between filling the stacking gaps effectively and maintaining structural integrity. This parameter optimization reduces pore formation while preserving the electrical performance of the stacked capacitor.
2Quantity of substance
If multiple capacitor structures are stacked, then the electrical capacity is enhanced, but the structural stability and vibration resistance are reduced
Solution Approach 1:
The insulating package body acts as a mediator between stacked capacitor structures, providing mechanical support and stability. It fills the stacking gaps to prevent relative displacement under vibration, thereby enhancing structural stability while maintaining high electrical capacity.
Solution Approach 2:
The insulating package body is formed as a composite structure combining insulating material with controlled solid content (60-80%). This composite material provides both mechanical strength for structural stability and electrical insulation properties, enabling stable multi-layer capacitor assemblies.
3Quantity of substance
If capacitor structures are stacked closely to increase capacity, then the device size is reduced, but moisture accumulates in pores causing structural cracks
Solution Approach 1:
The insulating package body serves as a moisture barrier intermediary between capacitor structures. By filling stacking gaps with this insulating material, it prevents moisture penetration and accumulation, eliminating the root cause of structural cracks while maintaining compact high-capacity design.
Solution Approach 2:
Optimizing the solid content of the insulating package body to 60-80% creates a dense enough structure to block moisture pathways while maintaining electrical insulation. This parameter control prevents moisture accumulation in stacking gaps, eliminating structural crack risks in compact high-capacity capacitors.
Data Source
AI summary
A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.