Capacitor Bonding Structure for Vibration Strength and Low ESR
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Solution Overview
Problem
Multilayer capacitors face challenges in achieving high capacitance in limited spaces while maintaining thermal and electrical reliability, especially in eco-friendly and electric vehicles, where they must withstand vibrations and deformation.
Innovation Solution
The design incorporates a capacitor body with dielectric layers and internal electrodes, external electrodes connected via bonding portions that include high melting point solder and conductive resin, which are strategically positioned to enhance bending strength and reduce equivalent series resistance (ESR).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the capacitor size is reduced to achieve high capacitance in limited space, then the capacitance density increases, but the thermal and electrical reliability deteriorates
Solution Approach 1:
The bonding portion uses a composite structure combining high melting point solder and conductive resin. The high melting point solder provides strong mechanical bonding and thermal conductivity, while the conductive resin fills gaps and provides electrical conductivity. This composite material approach allows the capacitor to maintain high capacitance density in a compact size while ensuring reliable thermal and electrical performance through the synergistic properties of the composite bonding material.
2Device complexity
If the capacitor structure is simplified to reduce manufacturing complexity, then the manufacturing cost decreases, but the resistance to vibrations and deformation deteriorates
Solution Approach 1:
The bonding portion is segmented into two distinct regions: a first region containing high melting point solder and a second region containing conductive resin. This segmentation allows each material to perform its specialized function - the solder provides structural strength and vibration resistance, while the resin provides electrical conductivity and deformation accommodation. The segmented structure achieves enhanced mechanical strength without significantly increasing manufacturing complexity, as both materials can be applied in sequence during the bonding process.
3Strength
If the bonding portion uses only high melting point solder, then the mechanical strength increases, but the electrical conductivity and flexibility deteriorates
Solution Approach 1:
The bonding portion merges two different materials - high melting point solder and conductive resin - into a single functional unit. The high melting point solder provides strong mechanical bonding and vibration resistance, while the conductive resin complements it by providing excellent electrical conductivity and flexibility. This merging of materials allows the bonding portion to simultaneously achieve high mechanical strength and good electrical conductivity, resolving the trade-off between these two properties.
4Reliability
If the bonding portion uses only conductive resin, then the electrical conductivity increases, but the mechanical strength and thermal conductivity deteriorate
Solution Approach 1:
The bonding portion combines conductive resin with high melting point solder to create a synergistic material system. The conductive resin provides excellent electrical conductivity, while the high melting point solder contributes strong mechanical strength and high thermal conductivity. By merging these two materials in the bonding portion, the capacitor achieves balanced performance with good electrical conductivity, strong mechanical bonding, and effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the bending strength and maintains low ESR, ensuring the capacitor's reliability and performance in vehicles by effectively distributing stress and minimizing cracks, while optimizing capacitance within compact dimensions.
Implementation Method 1
a first bonding portion disposed between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder
Data Source
AI summary
The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.