Capacitor Bus-bar with Thinned Lead Frame and Openings
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Solution Overview
Problem
Conventional bus-bars for capacitor devices have small diameter holes that interfere with soldering, leading to poor bonding and increased weight due to thick materials, and manual soldering operations often result in irregular intervals and short circuits.
Innovation Solution
A bus-bar with a thinner lead frame and opening parts to expose polar plates, reducing interference during soldering and weight, and incorporating a punching projection to maintain uniform intervals and prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If small diameter holes are provided on the bus-bar surface for soldering, then the bus-bar can be electrically connected to capacitor devices, but the holes interfere with soldering operations and cause poor bonding
Solution Approach 1:
The patent removes the holes from the bus-bar structure entirely and replaces them with a lead frame that extends through the bus-bar. This extraction of the problematic holes eliminates the interference they caused during soldering operations while maintaining the electrical connection function through the lead frame structure.
2Power
If thick material is used for the bus-bar to ensure sufficient current capacity, then the bus-bar can handle the current flow, but it takes a long time to heat the lead frame during soldering causing time-lag and poor bonding
Solution Approach 1:
The patent applies local quality by making the lead frame thinner than the main bus-bar body. The main bus-bar retains sufficient thickness for current capacity, while the lead frame portion that requires heating has reduced thickness to minimize thermal mass and reduce heating time during soldering operations.
Solution Approach 2:
The bus-bar structure is segmented into two distinct parts: the main bus-bar body with sufficient thickness for current handling, and the lead frame with reduced thickness for rapid heating. This segmentation allows each part to be optimized for its specific function without compromise.
3Reliability
If manual soldering operation is performed, then the bus-bar can be bonded to capacitor devices, but the operator must examine each bonding position individually and the process is time-consuming
Solution Approach 1:
The lead frame acts as an intermediary structure that facilitates automated soldering and inspection processes. Its standardized geometry and exposed configuration enable consistent bonding and allow for automated optical inspection, eliminating the need for manual examination of each bonding position.
4Productivity
If the bus-bar surface area increases to accommodate more capacitor devices, then more devices can be connected, but the whole weight of the capacitor module increases
Solution Approach 1:
The patent changes the geometric parameters of the bus-bar by introducing opening parts that reduce the material volume. The opening parts are strategically positioned to maintain electrical connection functionality while minimizing the overall material usage and weight of the bus-bar structure.
5Device complexity
If the bus-bar is soldered without opening parts, then the structure is simple, but the polar plates cannot be exposed and soldering is interfered with by the bus-bar material
Solution Approach 1:
The opening parts are created by removing material from the bus-bar surface, extracting the interfering bus-bar material in the regions where polar plates need to be accessed. This allows the polar plates to be exposed and soldering to proceed without obstruction while maintaining the overall structural integrity of the bus-bar.
Data Source
AI summary
A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of the capacitor module, in soldering the bus-bar to capacitor devices. The lead frame attached to polar plates by soldering is formed thinner than the other parts of the bus-bar, and opening parts having an oval or polygonal shape are formed on a surface of the bus-bar so that two adjoining capacitor devices can be exposed. The lead frame is formed in the opening in order for soldering with the polar plates of the capacitor device.