Capacitor Close Contact Portion Enhances Electrode Adhesion
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Solution Overview
Problem
Capacitors with nanoscale microstructure internal electrodes face issues with adhesiveness between the dielectric layer and conductor layers, leading to potential interface removal and reduced element properties due to stress or handling effects.
Innovation Solution
Incorporating a close contact portion with resin or metal material layers that bring the external electrode layers into close contact with the dielectric layer, enhancing adhesiveness and preventing delamination, while allowing for materials with low mutual adhesive strength to be used.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If nanoscale microstructure internal electrodes are used to downsize the element, then the element size is reduced and capacity is increased, but the connection area with conductor layers becomes very small, leading to poor adhesiveness and potential interface removal
Solution Approach 1:
The internal electrodes are segmented into multiple minute electrodes arranged in parallel, each contributing to the overall capacitance. This segmentation allows the electrodes to be filled throughout the dielectric layer volume, increasing the effective connection area with conductor layers while maintaining compact element dimensions
Solution Approach 2:
The patent transitions from planar electrode connections to three-dimensional distributed connections by filling multiple through-holes with internal electrodes. This vertical distribution through the dielectric layer thickness dimension significantly increases the total connection area between electrodes and conductor layers, resolving the adhesiveness problem while maintaining small footprint
2Adaptability or versatility
If conventional materials with low mutual adhesive strength are used, then material selection flexibility is improved, but the interface may be removed due to stress or handling effects
Solution Approach 1:
The patent applies different material properties to different regions: the internal electrodes use materials optimized for capacitance, while the external electrode layers use materials optimized for adhesion to the dielectric layer. This local differentiation allows flexible material selection for each component while ensuring reliable interfaces through appropriate material pairing
Solution Approach 2:
The capacitor structure combines multiple materials with complementary properties: dielectric layer, internal electrode materials, and external electrode materials. This composite approach enables selection of materials based on their specific functions, achieving both versatility in material choice and reliability in interface stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the adhesive strength of external electrode layers on the dielectric layer, increasing the durability of the capacitor and allowing for a wider selection of materials, thereby preventing interface removal and maintaining element characteristics.
Implementation Method 1
a close contact portion, which brings at least any one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer
Data Source
AI summary
A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The dielectric layer includes a first surface, a second surface facing the first surface, and a plurality of through-holes communicating between the first surface and the second surface. The first internal electrode portion is provided on a first through-hole portion. The second internal electrode portion is provided on a second through-hole portion. The close contact portion brings at least one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion, the third through-hole portion being the remaining portion of the plurality of through-holes.


