Capacitor Mounting Collet-Sleeve Assembly Thermal Dissipation

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Solution Overview

Problem

Film capacitors used in aircraft avionics and similar applications are sensitive to elevated temperatures, which affect their performance, and existing capacitors lack sufficient thermal conductivity to efficiently dissipate heat, making them temperature-limiting components.

Innovation Solution

A capacitor mounting method that includes a thermally conductive outer shell, a highly conductive conductor member, and a collet-sleeve assembly to facilitate heat transfer in both radial and axial directions, allowing for looser tolerancing and improved thermal connection to a bracket, thereby enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If film capacitors are used in aircraft avionics with large energy storage capacity, then power and energy storage are improved, but temperature control deteriorates due to insufficient thermal conductivity

Engineering Contradiction:
Improveenergy storage capacityVSAvoidheat dissipation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent introduces a three-dimensional thermal conduction path by adding a conductor member that extends axially through the capacitor assembly, complementing the traditional radial heat path through the outer shell. This multi-directional thermal management architecture enables heat to dissipate simultaneously in radial and axial directions, effectively addressing the temperature control issue while maintaining high energy storage capacity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductor member acts as a thermal intermediary, providing a dedicated high-conductivity pathway between the capacitor terminals and the mounting bracket. This intermediary component facilitates efficient heat transfer from the capacitor's internal heat-generating elements to the external heat sink, resolving the contradiction between high power capacity and temperature control

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If tight tolerances are specified for thermal connection components, then heat conduction is improved, but manufacturing cost and assembly complexity increase

Engineering Contradiction:
Improvethermal connection efficiencyVSAvoidfabrication and assembly cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The collet provides a mechanically compliant thermal connection that can dynamically adjust to variations in component dimensions and assembly tolerances. The spring-loaded or adjustable nature of the collet allows it to maintain optimal thermal contact pressure despite manufacturing variations, eliminating the need for extremely tight tolerances while preserving high thermal connection efficiency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the mechanical parameters of the thermal connection system by introducing a collet with adjustable clamping force and positioning characteristics. This parameter adjustment capability allows the system to accommodate a wider range of manufacturing tolerances while maintaining effective thermal contact, thereby reducing fabrication and assembly costs

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases the thermal conductivity of film capacitors, improving heat dissipation and reducing fabrication and assembly costs while increasing the reliability of the thermal connection, thus addressing the temperature sensitivity issues.

Implementation Method 1

a conductor member disposed within the outer shell and thermally coupled to the capacitor member

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The collet is pressed into the sleeve... effectively increases the thermal conductivity of film capacitors, improving heat dissipation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9757823B2Method of mounting a capacitor
Publication Date: 2017.09.12 HAMILTON SUNDSTRAND CORP
  • US9757823B2 patent drawing
  • US9757823B2 patent drawing

AI summary

A method of mounting a capacitor to a bracket is provided. The method includes the step of providing a capacitor with an outer shell, a capacitor member disposed within the shell and a conductor member disposed within the outer shell and thermally coupled to the capacitor member. A collet is arranged having a first opening sized to slidingly engage the conductor member. A sleeve is provided having a second opening sized to receive a first end of the collet. The collet is slid onto the conductor member. The collet is pressed into the sleeve.