Capacitor Structure With Conductive Vias For High Density
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Solution Overview
Problem
Existing capacitor structures face challenges in maximizing capacitance while minimizing manufacturing costs.
Innovation Solution
A capacitor structure featuring conductive vias that electrically couple adjacent conductive bars between parallel plates, increasing the overlapping area between electrodes and enhancing capacitance, with the conductive vias contributing significantly to the overall capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the overlapping area between electrodes is increased to improve capacitance, then the capacitance increases, but the device area and manufacturing complexity increase
Solution Approach 1:
The patent transitions from planar electrode overlapping to three-dimensional electrode interdigitated structures with conductive vias extending vertically. This dimensional change allows capacitance to be accumulated not only through lateral overlapping area but also through vertical conductive path length, effectively increasing capacitance without proportionally increasing the device footprint area.
Solution Approach 2:
The conductive vias are nested within the dielectric layer, with first conductive vias extending from first electrodes into the dielectric layer and second conductive vias extending from second electrodes into the dielectric layer. This nested configuration allows multiple conductive elements to occupy overlapping spatial regions, maximizing capacitance density within a compact volume.
2Reliability
If complex capacitor structures are designed to maximize capacitance, then capacitance increases, but manufacturing cost and process complexity increase
Solution Approach 1:
The capacitor structure is segmented into discrete conductive bars arranged in interdigitated patterns, with conductive vias selectively formed at specific locations between adjacent bars. This segmentation allows the complex three-dimensional capacitance enhancement to be achieved through standardized, repeatable unit cells that can be manufactured using conventional photolithography and etching processes, rather than requiring entirely new manufacturing techniques.
Solution Approach 2:
The conductive vias serve multiple functions: they provide electrical coupling between adjacent conductive bars, extend the effective capacitance-forming interface area, and create vertical electric field paths. This multi-functionality allows a single structural feature to address multiple design objectives, reducing the need for additional specialized components or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly increases capacitance by optimizing the lateral area of the conductive vias, achieving a capacitance contribution of over 5% (practically more than 10%), while maintaining cost-effectiveness.
Implementation Method 1
Capacitors, devices for storing electric charge
Implementation Method 2
The dielectric layer is disposed between the first conductive plates and the second conductive plates
Data Source
AI summary
A capacitor structure includes a first electrode structure, a second electrode structure, and a capacitor dielectric. The first electrode structure includes a plurality of first conductive plates vertically disposed and parallel to one another. The second electrode structure includes a plurality of second conductive plates disposed alternately with the first conductive plates. Each first conductive plate includes a plurality of first conductive bars electrically coupled to the first conductive bar stacked thereon with at least a first conductive via. Each second conductive plate includes a plurality of second conductive bars electrically coupled to the second conductive bar stacked thereon with at least a second conductive via.