Capacitor Contact Assistant Layer for Lower Resistance Overlay

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Solution Overview

Problem

The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in reducing the resistance of capacitor structures and increasing the overlay window between contact and capacitor structures.

Innovation Solution

A semiconductor device design incorporating an assistant layer made of germanium or silicon germanium between the contact and capacitor structures, which reduces the resistance of the capacitor structure and minimizes its exposed area, thereby increasing the overlay window and design flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the dimensions of semiconductor devices are scaled down, then computing ability is improved, but resistance of capacitor structures increases and overlay window decreases

Engineering Contradiction:
Improvecomputing abilityVSAvoidresistance of capacitor structure
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

An assistant layer comprising germanium or silicon germanium is introduced between the contact structure and the capacitor structure. This intermediary layer reduces the resistance of the capacitor structure by providing a low-resistance path, thereby improving electrical performance without requiring增大 the exposed area of the capacitor structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the material parameter of the assistant layer to germanium or silicon germanium, which have higher carrier mobility and lower resistivity compared to conventional materials. This parameter change enables reduced capacitor structure resistance while maintaining compact dimensions suitable for scaled-down devices.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the exposed area of capacitor structure is reduced, then overlay window is improved, but resistance of capacitor structure increases

Engineering Contradiction:
Improveoverlay windowVSAvoidresistance of capacitor structure
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The assistant layer acts as a mediator that decouples the relationship between exposed area and resistance. By introducing this intermediate germanium or silicon germanium layer, the capacitor structure can maintain a small exposed area for improved overlay window while the assistant layer compensates for the resistance increase through its superior electrical properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assistant layer effectively reduces the resistance of the capacitor structure, allowing for a smaller exposed area and increased overlay window, enhancing the semiconductor device's performance and design flexibility.

Implementation Method 1

the resistance of the capacitor structure may be reduced by employing the assistant layer formed on the exposed portion of the capacitor structure

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12080754B2Semiconductor device with assistant layer and method for fabricating the same
Publication Date: 2024.09.03 NAN YA TECH
  • US12080754B2 patent drawing
  • US12080754B2 patent drawing
  • US12080754B2 patent drawing

AI summary

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a semiconductor device including a first substrate; a capacitor structure positioned on the first substrate and including an exposed portion; a contact structure deposited on the exposed portion; an assistant layer positioned between the contact structure and the exposed portion; and a bonding structure positioned on the contact structure. The assistant layer includes germanium or silicon germanium.