Ceramic Capacitor-Cooled Power Module for Low-Inductance Packaging
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Solution Overview
Problem
Existing power semiconductor modules face challenges in achieving high integration and packing density due to inadequate thermal management, often requiring separate heat sinks and spatial separation of components, which leads to increased parasitic inductances and reduced efficiency.
Innovation Solution
A module incorporating a power semiconductor component and a ceramic capacitor that serves as both a cooling element and a carrier, connected via a high thermal conductivity silver-containing layer, eliminating the need for additional heat sinks and spatial separation, thereby reducing parasitic inductances and enabling a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat sink is used to cool the power semiconductor component, then thermal management is achieved, but the module size increases and integration density decreases
Solution Approach 1:
The patent combines the heat sink function with the ceramic capacitor by integrating the heat dissipation structure into the capacitor body. The capacitor's housing is designed to serve dual purposes: electrical capacitance function and thermal management function, thereby eliminating the need for a separate heat sink component and reducing overall module volume.
Solution Approach 2:
The ceramic capacitor is designed to perform multiple functions simultaneously: it provides electrical capacitance for voltage stabilization and serves as a heat sink for thermal management. This multi-functional design allows the same component to address both electrical and thermal requirements, improving integration density while maintaining effective cooling.
2Reliability
If the ceramic capacitor is spatially separated from the power semiconductor component, then the capacitor can perform its voltage stabilization function, but parasitic inductances increase due to longer conduction paths
Solution Approach 1:
The patent merges the ceramic capacitor and power semiconductor component into a single integrated assembly where the capacitor is positioned adjacent to the component. This close integration minimizes the length of conduction paths between the two elements, thereby reducing parasitic inductances while maintaining the capacitor's voltage stabilization function.
3Temperature
If additional heat sink components are added to the module, then cooling capacity is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The ceramic capacitor is designed to serve dual functions: electrical capacitance and heat dissipation. By making the capacitor housing itself serve as the heat sink structure, the patent eliminates the need for additional cooling components, thereby reducing device complexity and manufacturing steps while maintaining effective cooling capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the power semiconductor component, reduces parasitic inductances, and allows for a more compact, efficient module design with improved electrical performance and thermal management.
Implementation Method 1
The ceramic capacitor and the power semiconductor component are connected to one another by a layer containing at least silver. This layer exhibits good thermal conductivity and thus enables heat to be dissipated from the power semiconductor component.
Implementation Method 2
A module is proposed which comprises a power semiconductor component and a ceramic capacitor which is designed to cool the power semiconductor component.
Data Source
Figure 1~2
AI summary
The present invention relates to a module (1) comprising a power semiconductor device (2) and a ceramic capacitor (3) designed to cool the power semiconductor device (2).