Power Converter Capacitor Cooling via Segmented Thermal Zones
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Solution Overview
Problem
In power converters, the heat generated by semiconductor modules can transfer to capacitor modules via bus bars, leading to increased temperatures and reduced cooling efficiency, which shortens the lifespan of the capacitor module.
Innovation Solution
A power converter design where the capacitor module is positioned apart from the cooling surface and connected via heat conductive members with a heat radiation portion that is thermally connected to the cooling surface at a distance from the semiconductor module, reducing inductance and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the capacitor module is brought closer to the semiconductor module to reduce bus bar inductance, then the power converter performance is improved, but the capacitor module is exposed to higher temperatures from the semiconductor module's heat generation
Solution Approach 1:
The cooling system is segmented into distinct cooling zones: a first cooling region for the semiconductor module and a second cooling region for the capacitor module. The heat radiating portion extends into the first cooling region to provide dedicated heat radiation away from the capacitor module, while the capacitor module is cooled by the second cooling region. This segmentation allows the capacitor module to be positioned close to the semiconductor module for low inductance while maintaining separate thermal management zones.
Solution Approach 2:
The heat radiating portion acts as an intermediary heat transfer component that captures heat from the capacitor module and redirects it to the first cooling region. This intermediary structure prevents direct heat exposure to the capacitor module while enabling effective heat removal, resolving the conflict between close positioning for performance and temperature control for reliability.
2Device complexity
If a shared cooler is used for both semiconductor module and capacitor module, then the structure is simplified, but the capacitor module is less effectively cooled due to heat influence from the semiconductor module
Solution Approach 1:
The cooler is divided into a first cooling region and a second cooling region with different thermal characteristics. The first cooling region is designed to handle heat from the semiconductor module, while the second cooling region is optimized for the capacitor module. The heat radiating portion bridges these regions to actively manage heat distribution, ensuring the capacitor module is cooled by the second cooling region rather than being exposed to the higher temperature environment of the first cooling region.
Solution Approach 2:
Different regions of the cooler are designed with different thermal properties: the first cooling region accommodates the high heat generation of the semiconductor module, while the second cooling region provides a cooler environment suitable for the capacitor module. The heat radiating portion is strategically positioned to utilize the thermal gradient between these regions, radiating heat away from the capacitor module while maintaining effective cooling.
3Volume of moving object
If the capacitor module is positioned within the cooler range for compact design, then the overall size is reduced, but the cooling efficiency for the capacitor module decreases due to proximity to the semiconductor module's heat source
Solution Approach 1:
The cooling system is segmented into thermal zones that allow compact positioning of components while maintaining effective cooling. The heat radiating portion extends into the first cooling region to create a thermal boundary that protects the capacitor module from excessive heat exposure, enabling compact design without sacrificing cooling efficiency.
Solution Approach 2:
The heat radiating portion serves as an intermediary heat management structure that enables the capacitor module to be positioned in a compact arrangement while still achieving effective cooling. It captures and redirects heat away from the capacitor module, allowing the power converter to maintain a compact footprint without compromising the cooling efficiency of the capacitor module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the transfer of heat from semiconductor modules to capacitor modules, allowing for improved cooling of both components and enhancing the overall performance of the power converter.
Implementation Method 1
a heat conductive member provided in the capacitor module main body, the heat conductive member having a heat radiation portion, the heat radiation portion being thermally connected to the cooling surface
Implementation Method 2
a cooler having a cooling surface formed therein; a semiconductor module provided on the cooling surface
Data Source
AI summary
Provided is a power converter which enables improved performance, and allows each of a semiconductor module and a capacitor module to be more reliably cooled. In a power converter, a capacitor module includes a capacitor module main body facing a cooling surface of a cooler, while being apart from the cooling surface, and a heat conductive member provided in the capacitor module main body. The capacitor module main body is connected to a semiconductor module via an N-side bus bar and a P-side bus bar. A heat radiation portion of the heat conductive member is thermally connected to the cooling surface at a position more distant from the semiconductor module than an end portion of the capacitor module main body which is closer to the semiconductor module.