Multilayered Capacitor Core-Shell Grain Boundary Insulation
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Solution Overview
Problem
As multilayered capacitors become thinner and have higher capacities, there is a limit to increasing the fraction of dielectric grain boundaries to secure insulation resistance, making it challenging to maintain reliability, especially under high temperature and moisture conditions.
Innovation Solution
A multilayered capacitor design that incorporates dielectric grains with a core-shell structure, where the core, shell, and core-shell wall have different minor component concentrations, and the ratio of the average diameter of dielectric grains to cores is between 1.2 and 1.8, with core-shell walls containing a higher amount of minor component, effectively suppressing electron and ion carrier migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the fraction of dielectric grain boundaries is increased to secure insulation resistance, then reliability is improved, but the capacitor thickness cannot be reduced and capacity cannot be increased
Solution Approach 1:
The patent applies local quality by creating a core-shell structure where the shell region has a different composition (higher minor component content) than the core, specifically designing the grain boundary regions to have enhanced insulating properties through localized compositional modification rather than uniform changes throughout the entire dielectric layer
Solution Approach 2:
The patent uses composite materials by combining major and minor components in specific ratios within the core-shell structure, where the shell region contains a higher concentration of minor components (0.1-5.0 at%) compared to the core, creating a composite dielectric structure that simultaneously achieves high insulation resistance and reduced thickness
2Productivity
If the capacitor is made thinner with higher capacity, then miniaturization and performance improvement are achieved, but the ability to maintain insulation resistance deteriorates
Solution Approach 1:
The patent implements local quality by concentrating insulating功能的 minor components specifically in the shell and grain boundary regions, allowing the bulk of the capacitor to be optimized for capacitance while localized regions maintain insulation resistance, thus achieving high capacitance density without sacrificing reliability
Solution Approach 2:
The patent applies parameter changes by precisely controlling the minor component concentration in the shell region (0.1-5.0 at%) and optimizing the core-shell diameter ratio (0.3-0.8), which enables the dielectric layer to maintain insulation resistance even at reduced thickness while achieving higher capacitance density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of multilayered capacitors by preventing degradation of insulation resistance, even under high voltage applications, without increasing the grain boundary fraction, thus addressing the limitations of existing technologies.
Implementation Method 1
suppressing migration of electrons and ion carriers upon voltage application to prevent degradation of insulation resistance
Implementation Method 2
suppressing migration of electrons and ion carriers upon voltage application to prevent degradation of insulation resistance
Data Source
AI summary
A multilayered capacitor according to an embodiment includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that are disposed on the outside of the capacitor body, and the dielectric layer contain a plurality of dielectric grains containing a major component and a minor component, and at least one of the plurality of dielectric grains has a core-shell structure including a core, a shell, and a core-shell wall positioned between the core and the shell, and between at least two dielectric grains of the plurality of dielectric grains, a grain boundary is included, and when the average concentration of the minor component in the grain boundary is denoted by CGB (at %) and the average concentration of the minor component in the core-shell wall is denoted by CCS (at %), CCS/CGB is in a range from 0.40 to 0.75.