Capacitor-Coupled Shield and Plate Electrodes for Stacked Memory Access

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Solution Overview

Problem

Conventional integrated memory architectures face challenges in maintaining stable voltage across large conductive expanses and accessing components of stacked memory decks for coupling to control circuitry, which complicates the integration and operation of multi-deck memory structures.

Innovation Solution

The implementation of voltage sources coupled to shield and plate electrodes through capacitors, utilizing interconnects and access capacitors to stabilize voltage across conductive expanses and facilitate access to components within multi-deck assemblies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple decks of memory are stacked to increase packing density, then integration level increases, but accessibility of components for coupling to control circuitry deteriorates

Engineering Contradiction:
Improveintegration levelVSAvoidaccessibility of components
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent transitions from planar interconnections to three-dimensional vertical interconnections. Conductive vias extend through intermediate decks to connect control circuitry with memory cells in stacked decks, enabling access to components in higher dimensions without increasing lateral complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The memory structure is divided into multiple discrete decks stacked vertically, with control circuitry separated from memory arrays. This segmentation allows independent optimization of control and storage functions while maintaining compact integration through vertical stacking.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If large conductive expanses are used for common plates, then manufacturing simplicity is maintained, but voltage stability across the conductive expanses deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidvoltage stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

Capacitors are introduced as intermediary elements between the common plate and voltage sources. These capacitors act as voltage stabilization devices that filter fluctuations and maintain stable voltage levels across the large conductive expanses without requiring changes to the plate geometry or manufacturing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If voltage sources are directly coupled to common plates, then circuit complexity is reduced, but voltage stability deteriorates due to fluctuations

Engineering Contradiction:
Improvecircuit complexityVSAvoidvoltage stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

Capacitors are positioned between voltage sources and common plates to serve as voltage stabilization intermediaries. This adds minimal circuit complexity while significantly improving voltage stability by filtering out fluctuations and providing localized energy storage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Capacitors are pre-positioned between voltage sources and common plates to cushion against voltage fluctuations before they can affect the memory cells. This preventive measure stabilizes voltage proactively rather than reactively.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides more stable voltage to capacitor and shield plates, reducing undesired fluctuations and enhancing the accessibility of components within stacked memory decks, thereby improving the integration and operational efficiency of multi-deck memory structures.

Implementation Method 1

A first voltage source may be coupled to the shield plate through one or more capacitors. A second voltage source may be coupled to the plate electrode through one or more capacitors.

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20250338474A1Integrated Assemblies having Voltage Sources Coupled to Shields and/or Plate Electrodes through Capacitors
Publication Date: 2025.10.30 MICRON TECHNOLOGY INC
  • US20250338474A1 patent drawing
  • US20250338474A1 patent drawing
  • US20250338474A1 patent drawing

AI summary

Some embodiments include an integrated assembly having first conductive lines which extend along a first direction, and having second conductive lines over the first conductive lines and which extend along a second direction that crosses the first direction. Capacitors are over the second conductive lines. The second conductive lines are operatively proximate active structures to gatedly couple a first set of the capacitors to the first conductive lines through the active structures. Shield structures are between the first conductive lines and extend along the first direction. A voltage source is electrically coupled to the shield structures through a second set of the capacitors. Some embodiments include assemblies having two or more decks stacked one atop another.