Multilayer Capacitor Cover Crystal Phase for Heat and Crack Resistance

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Solution Overview

Problem

Existing multilayer ceramic capacitors face challenges in achieving high-temperature reliability and stability due to difficulties in controlling the microstructure of core-shell dielectric crystal grains, which affect electrical properties and are prone to cracking and moisture absorption.

Innovation Solution

A multilayer electronic component design featuring cover portions with a crystal phase made of an oxide including a rare earth element and Si, where the area ratio of the crystal phase on the surface exceeds that in the cross-section, reducing thermal conductivity and thermal expansion, thereby improving high-temperature reliability and moisture resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a core-shell structure is used in dielectric crystal grains to improve high-temperature reliability, then thermal stability is improved, but microstructure control becomes difficult and electrical properties are affected

Engineering Contradiction:
Improvehigh-temperature reliabilityVSAvoidmicrostructure control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the chemical composition parameters of the dielectric layer by introducing a specific oxide containing a rare earth element and Si, which modifies the crystal phase formation and microstructure without requiring complex core-shell architecture. This compositional parameter change achieves both microstructure control and high-temperature reliability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite dielectric material by combining the base dielectric layer with an oxide containing rare earth element and Si. This composite approach improves high-temperature reliability through the formation of beneficial crystal phases while maintaining manufacturability, avoiding the complexity of core-shell structures.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the crystal phase area ratio on the surface is increased to improve high-temperature reliability, then thermal conductivity is reduced and cracking is prevented, but the component size in the first direction increases

Engineering Contradiction:
Improvehigh-temperature reliabilityVSAvoidcomponent size in first direction
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent applies local quality by concentrating the crystal phase formation specifically in the cover portions rather than uniformly throughout the entire component. By controlling the crystal phase to form predominantly in the cover portions with area ratio S1 > S2, the patent achieves improved high-temperature reliability at the surfaces while minimizing the impact on overall component dimensions.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent addresses the size issue by transitioning from a uniform three-dimensional distribution to a surface-concentrated two-dimensional distribution of the crystal phase. The condition S1 > S2 ensures the crystal phase is primarily distributed on the surfaces (first and second surfaces) rather than uniformly through the volume, thus improving surface properties without proportionally increasing overall component size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances the component's reliability by lowering thermal conductivity and preventing cracking, while maintaining electrical properties, thus ensuring stability under high temperatures.

Implementation Method 1

One of the cover portions includes one or more crystal phases formed of an oxide including a rare earth element and Si... reducing thermal conductivity

Methodology Applied
Scientific EffectPhonon scattering:

Implementation Method 2

One of the cover portions includes one or more crystal phases formed of an oxide including a rare earth element and Si... reducing thermal expansion

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250218676A1Multilayer electronic component
Publication Date: 2025.07.03 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250218676A1 patent drawing
  • US20250218676A1 patent drawing
  • US20250218676A1 patent drawing

AI summary

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and cover portions disposed in upper and lower portions in the first direction of the capacitance formation portion, respectively, and including first and second surfaces opposing each other in the first direction; external electrodes disposed on the body. One of the cover portions includes one or more crystal phases having an oxide including a rare earth element and Si. When an area ratio occupied by the crystal phase in a central portion of one of the first and second surfaces is defined as S1, and an area ratio occupied by the crystal phase in a central portion of a cross-section in the first and third directions of the one of the cover portions is defined as S2, S1>S2 is satisfied.