Multilayer Capacitor Curved Edge Electrode Positioning

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Solution Overview

Problem

Electronic components face issues with chipping during manufacturing due to corner strength limitations and plating solution infiltration, which affects reliability and capacitance.

Innovation Solution

The electronic component design features a curved corner and edge line portion with internal electrodes positioned to avoid plating solution entry, using a configuration where connecting portions are aligned with the end surface and electrode portions overlap the curved edges, enhancing reliability and capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If corner portions and edge line portions of the element body are formed into curved surface shape to suppress chipping, then reliability against mechanical damage is improved, but thickness of the external electrode at these portions decreases causing plating solution to easily enter

Engineering Contradiction:

Improveresistance to chippingVSAvoidplating solution infiltration

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The element body has corner portions and edge line portions formed into curved surface shapes. This curvature design suppresses chipping occurrence during manufacturing by eliminating sharp corners and edges that are prone to mechanical damage, while maintaining overall structural integrity.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The connecting portions of internal electrodes are specifically positioned in regions corresponding to the end surface rather than the curved edge portions. This localized positioning strategy ensures that critical electrode connections are placed where external electrode thickness is sufficient, preventing plating solution infiltration at these specific locations while maintaining the curved geometry elsewhere for chipping resistance.

Inventive Principle:

Principle #3Local quality

2Reliability

If external electrode thickness is increased to prevent plating solution entry, then reliability is improved, but capacitance increases are limited

Engineering Contradiction:

Improveprevention of plating solution entryVSAvoidcapacitance

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The solution applies local quality by differentiating the positioning strategy for different portions of internal electrodes. The connecting portions are positioned in regions corresponding to end surfaces where adequate external electrode thickness prevents plating solution entry, while the electrode portions are allowed to extend into regions corresponding to curved edge portions to maximize capacitance without compromising reliability at critical connection points.

Inventive Principle:

Principle #3Local quality

3Quantity of substance

If internal electrode connecting portions are positioned in regions corresponding to curved edge portions to increase capacitance, then capacitance is improved, but plating solution can easily enter through these portions

Engineering Contradiction:

ImprovecapacitanceVSAvoidplating solution infiltration

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The connecting portions of internal electrodes are specifically positioned in regions corresponding to the end surface when viewed from a direction perpendicular to the end surface, avoiding regions corresponding to curved edge line portions. This localized positioning ensures that electrode connections occur where external electrode thickness is sufficient to prevent plating solution infiltration, while still allowing electrode portions to extend into curved regions for capacitance enhancement.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses plating solution infiltration, improving the reliability and increasing capacitance of the electronic component while minimizing chipping risks.

Implementation Method 1

The plated layer is formed on the electrode layer using a plating method

Methodology Applied

Scientific EffectPlating method: Electroplating

Data Source

PatentUS11437189B2Electronic component having plurality of internal electrodes

Publication Date: 2022.09.06 TDK CORP

AI summary

A multilayer capacitor 1 includes an element body, an external electrode, and a plurality of internal electrodes. The plurality of internal electrodes include electrode portions disposed to face other internal electrodes and connecting portions connecting the electrode portions to the external electrode. The connecting portions of the internal electrodes are positioned in a region corresponding to an end surface when viewed from a direction perpendicular to the end surface. The electrode portions of the internal electrodes have portions overlapping a region corresponding to an edge line surfaces when viewed from the direction perpendicular to the end surface.