Capacitor with Cut Terminals for Vibration Damping
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations, which can be perceived as abnormal noise in quiet environments and degrade device quality, and high-frequency vibrations can cause malfunctions in sensors used in IT and industrial fields.
Innovation Solution
The electronic component design includes cut portions on connection terminals and external electrodes, forming solder accommodating portions to reduce vibration transfer to the board, utilizing metal and insulating materials with land patterns for electrical connection, and plating layers to enhance adhesion and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the multilayer capacitor uses piezoelectric dielectric material to achieve capacitance function, then the capacitor can store and release electrical energy, but the piezoelectric vibrations generate acoustic noise in audio frequency range and high-frequency vibrations that can cause sensor malfunctions
Solution Approach 1:
The patent introduces a damping material as an intermediary substance between the capacitor body and the board. This damping material absorbs the vibrations generated by the piezoelectric capacitor body, preventing them from being transmitted to the board and causing acoustic noise or sensor malfunctions. The damping material acts as a mediator that decouples the vibration source from the mounting structure.
Solution Approach 2:
The patent converts the harmful piezoelectric vibrations into beneficial damping effects by applying a damping material with opposite piezoelectric properties or high damping characteristics. The vibration energy that would otherwise cause noise is transformed into heat or dissipated through the damping material's internal friction, turning a harmful effect into a controlled energy dissipation mechanism.
2Reliability
If the capacitor body is directly mounted on the board with standard connection terminals, then the electrical connection is simple and reliable, but the vibrations are directly transferred to the board causing acoustic noise
Solution Approach 1:
The patent segments the connection structure by introducing a damping material layer between the capacitor body and the board. This segmentation separates the electrical connection function from the mechanical mounting function, allowing the capacitor to maintain reliable electrical connection while the damping material prevents vibration transfer to the board.
Solution Approach 2:
The patent uses composite material structure consisting of the capacitor body and damping material combined together. The composite structure maintains electrical conductivity through the capacitor terminals while the damping material component provides vibration isolation, achieving both electrical reliability and vibration reduction.
3Ease of manufacture
If the capacitor body uses conventional structure without damping treatment, then the manufacturing process is simple and cost-effective, but acoustic noise cannot be suppressed in quiet environments
Solution Approach 1:
The patent applies preliminary action by pre-coating or pre-attaching the damping material to the capacitor body during the manufacturing process. This preliminary treatment ensures that the damping material is already in place before mounting, simplifying the overall manufacturing process while effectively suppressing acoustic noise without requiring complex post-assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses acoustic noise in the audio frequency range and high-frequency vibrations, improving the operational quality of electronic devices and preventing sensor malfunctions by absorbing vibrations and reducing solder height, thus enhancing noise reduction.
Implementation Method 1
Since a dielectric material of a multilayer capacitor has piezoelectric properties, the multilayer ceramic capacitor may be synchronized with an applied voltage to thereby be deformed
Implementation Method 2
a damping material, and a mounting structure to which the capacitor body and the connection terminals are mounted. The damping material may be interposed between the capacitor body and the mounting structure
Data Source
AI summary
An electronic component includes: a capacitor body; first and second external electrodes disposed on both ends of the capacitor body in a length direction; and first and second connection terminals disposed on a mounting surface of the capacitor body and electrically connected to the first and second external electrodes, respectively, and having first and second cut portions on surfaces facing each other in the length direction of the capacitor body, respectively.