Multilayer Capacitor Damping Terminals for Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer capacitors generate acoustic noise due to piezoelectric vibrations, which can be mistaken for device faults and degrade audio output quality, especially when solder connections transfer these vibrations to circuit boards.
Innovation Solution
The design includes bump terminals with specific area ratios and alumina material for the connection terminals, which create solder accommodating portions to absorb and block vibrations, reducing the transfer of piezoelectric vibrations to the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder volume and height are increased to improve electrical connection, then connection reliability is improved, but acoustic noise increases due to enhanced vibration transfer
Solution Approach 1:
The patent introduces a damping material as an intermediary substance between the solder and the multilayer capacitor body. This damping material acts as a mediator that absorbs vibrations while maintaining electrical connection, thus reducing acoustic noise without compromising connection reliability. The damping material is applied in the solder accommodating portion to create a vibration-absorbing interface.
Solution Approach 2:
The patent employs a damping material in the form of a thin film or layer within the solder accommodating portion. This flexible damping layer absorbs mechanical vibrations from the capacitor body while allowing electrical connectivity through the solder connection, effectively decoupling the vibration transfer path from the electrical connection path.
2Strength
If solder volume is increased to improve mechanical strength, then connection strength is improved, but vibration transfer to circuit board is enhanced
Solution Approach 1:
The damping material serves as an intermediary that differentiates between mechanical strength requirements and vibration transfer prevention. It allows the solder to maintain strong mechanical attachment while absorbing vibrational energy before it can transfer to the circuit board through the solder joint.
Solution Approach 2:
The patent creates a composite connection structure consisting of solder and damping material. This composite approach combines the electrical conductivity and mechanical strength of solder with the vibration-damping properties of the damping material, achieving both strong connection and reduced vibration transfer.
3Reliability
If dielectric material with piezoelectric properties is used to achieve high capacitance, then capacitance performance is improved, but acoustic noise is generated due to piezoelectric vibrations
Solution Approach 1:
The patent acknowledges the piezoelectric effect as an inherent property of the dielectric material that generates vibrations. Instead of changing the dielectric material, it converts this harmful vibration into a manageable issue by introducing damping material that specifically targets and absorbs these piezoelectric vibrations, transforming the problem into a controlled vibration isolation scenario.
Solution Approach 2:
The damping material acts as an intermediary between the piezoelectric dielectric layers and the external environment (circuit board and solders). It absorbs the vibrational energy generated by the piezoelectric effect before it can propagate outward, allowing the capacitor to maintain high capacitance performance while eliminating the acoustic noise issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively decreases acoustic noise by suppressing piezoelectric vibrations and preventing vibration transfer, enhancing the reliability and audio quality of electronic devices.
Implementation Method 1
create solder accommodating portions to absorb and block vibrations, reducing the transfer of piezoelectric vibrations to the circuit board
Implementation Method 2
since a dielectric material of the dielectric layer may have piezoelectric properties, vibration sound may be generated due to a piezoelectric phenomenon
Data Source
AI summary
A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.