Capacitor Component Dielectric Patterns Prevent Electrode Bending

The patent applies preliminary action by forming the dielectric pattern on the dielectric layer before laminating the internal electrodes. This dielectric pattern serves as a pre-formed structure that compensates for thickness differences, preventing step portions from forming during the densification process. By preparing this compensatory structure in advance, the patent eliminates the root cause of internal electrode bending while maintaining high capacitance through increased layer count.

The patent applies local quality by forming a dielectric pattern with specific thickness characteristics at the precise location where thickness differences occur between internal electrodes and dielectric layers. Rather than uniformly increasing the thickness of all dielectric layers, the invention locally compensates for thickness variations only where needed. This targeted approach eliminates step portions and air traps in critical areas while maintaining the overall high-capacitance structure through increased layer count.

The patent applies preliminary action by forming the dielectric pattern before lamination to prevent step portions from forming in the first place. This pre-formed compensation structure eliminates the need to depress margin portions during the densification process. By addressing the thickness difference issue beforehand, the invention maintains both margin width and internal electrode stability while still achieving high manufacturing precision through the elimination of empty spaces.