Multilayer Capacitor Bonding with Discontinuous Conductive Layer
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Solution Overview
Problem
Multilayer capacitors face durability issues due to thermal and mechanical stress during board mounting, leading to deterioration of the bonding interface between the external electrode and the metal frame, especially in temperature cycling environments, which affects their reliability and adhesion.
Innovation Solution
A conductive bonding layer with discontinuous regions is introduced between the external electrode and the metal frame, reducing thermal stress by creating spaces between bonded areas and improving bonding strength, while maintaining a sufficient bonding area to ensure adhesion at room temperature and resistance to temperature cycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a continuous conductive bonding layer is used between the external electrode and metal frame, then bonding strength is improved, but thermal stress deterioration occurs during temperature cycling
Solution Approach 1:
The conductive bonding layer is divided into discrete bonding regions separated by discontinuous regions, transforming a continuous structure into a segmented one. This segmentation allows the bonding layer to maintain adequate adhesion strength while creating expansion gaps that reduce thermal stress during temperature cycling, directly resolving the contradiction between bonding strength and thermal reliability
2Area of stationary object
If the multilayer capacitor is mounted close to the board, then space utilization is improved, but mechanical durability against vibrations deteriorates
Solution Approach 1:
The discontinuous regions in the conductive bonding layer act as pre-designed cushioning spaces that absorb mechanical stresses from vibrations and deformations before they can damage the bonding interface. This beforehand cushioning allows the capacitor to be mounted closer to the board while maintaining mechanical durability
3Strength
If the bonding area is increased to improve adhesion, then bonding strength is improved, but thermal stress concentration increases during temperature cycling
Solution Approach 1:
The bonding area is segmented into multiple discrete bonding regions rather than one continuous area. This segmentation maintains total adhesion strength while distributing thermal stress across separate zones, preventing stress concentration that would occur in a continuous bonding layer during temperature cycling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the durability and reliability of multilayer capacitors by reducing thermal stress and preventing adhesion deterioration, ensuring improved bonding strength and mechanical resistance to vibrations and deformations.
Implementation Method 1
In a temperature cycling environment, deterioration may occur between an external electrode and a conductive bonding material and between a metal frame and the conductive bonding material due to a difference in coefficients of thermal expansion
Data Source
AI summary
An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.